Self-Referencing Pin Crosstalk Reduction
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Solution Overview
Problem
Current semiconductor package designs face significant challenges in reducing crosstalk induced by socket pins, which hampers electrical performance and leads to increased package size and cost due to the need for numerous Vss pins for shielding high-speed signals.
Innovation Solution
The introduction of self-referencing socket pins with a dielectric insulator between pin portions reduces crosstalk by acting as separate signal and ground pins, allowing for a smaller package size and reduced Vss pins, thereby improving electrical performance and lowering manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If Vss pins are added to shield high-speed signals, then crosstalk is reduced, but package size and manufacturing cost increase
Solution Approach 1:
The patent combines the signal pin and ground pin into a single integrated structure where the ground pin is formed as an outer conductor surrounding the inner conductor signal pin. This merging eliminates the need for separate Vss shielding pins while maintaining crosstalk reduction, thereby reducing package size without compromising signal integrity.
Solution Approach 2:
The socket pin structure performs multiple functions simultaneously: the inner conductor serves as the signal transmission path while the outer conductor provides both the return path and electromagnetic shielding. This multi-functionality replaces the traditional separate signal pin and Vss shielding pin configuration, reducing the total pin count and package size.
2Object-affected harmful factors
If Vss pins are added to shield high-speed signals, then crosstalk is reduced, but manufacturing cost increases
Solution Approach 1:
By merging the signal and ground functions into a single socket pin assembly with coaxial conductors, the patent eliminates the need for additional Vss pins and their associated mounting holes, plating layers, and assembly steps. This simplification directly reduces manufacturing complexity and cost while maintaining effective electromagnetic shielding.
Solution Approach 2:
The multi-functional socket pin that simultaneously provides signal transmission, return path, and shielding eliminates the need for separate dedicated ground pins. This reduction in component count and assembly operations directly lowers manufacturing costs while maintaining crosstalk protection.
3Ease of manufacture
If socket pin structure is simplified, then manufacturing cost decreases, but crosstalk increases
Solution Approach 1:
The patent achieves both simplification and effectiveness by combining the ground shielding function with the signal transmission function in a single coaxial pin structure. This integrated design eliminates complex multi-pin configurations while maintaining superior electromagnetic shielding performance, thus reducing crosstalk without increasing manufacturing complexity.
Solution Approach 2:
The socket pin employs a composite coaxial structure with inner conductor, dielectric insulation layer, and outer conductor, creating an integrated electromagnetic shield that provides superior crosstalk protection. This composite design achieves effective shielding in a single component, simplifying manufacturing while maintaining or improving electromagnetic compatibility performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively minimizes crosstalk, enhances electrical performance for high-speed signals, and reduces package size and manufacturing costs by eliminating the need for additional Vss pins, while maintaining effective shielding of high-speed signals.
Implementation Method 1
a dielectric insulator between pin portions reduces crosstalk by acting as separate signal and ground pins
Data Source
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AI summary
Methods and apparatus relating to self-referencing pins are described. In one embodiment, a pin electrically couples a first agent to a second agent. The pin includes two or more portions that are at least partially separated by an insulator, e.g., to improve crosstalk performance. Other embodiments are also disclosed and claimed.