Self-Repairing IC Package with Microcapsule Healing
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Solution Overview
Problem
The packaging of semiconductor dies is prone to delamination due to thermal and mechanical stresses caused by heating and cooling cycles, leading to potential failure of the integrated circuit as the molding compound, die, and substrate expand or contract at different coefficients, resulting in compressive, expansive, and tensile forces that can cause cracks and separation.
Innovation Solution
A delamination repair substance comprising microcapsules containing a liquid sealing agent and a catalyst, such as dicyclopentadiene and Grubbs catalyst, is applied between the semiconductor die and the molding compound, which ruptures and polymerizes upon perturbation to re-bond the molding compound to the die, effectively repairing cracks and preventing further delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the integrated circuit is subjected to heating and cooling cycles during operation and testing, then the die can be tested for functionality and the package can be validated, but thermal stress causes delamination between the molding compound, die, and substrate
Solution Approach 1:
A repair substance is applied to the die surface before packaging, positioned at locations where delamination is most likely to occur. This preliminary placement of repair material allows the substance to be ready and activated only when thermal stress actually causes delamination, rather than attempting to prevent delamination from occurring in the first place
Solution Approach 2:
The repair substance contains microcapsules with sealing agent and catalyst that remain dormant during normal operation. When delamination occurs due to thermal cycling, the stress activates the repair mechanism by rupturing microcapsules, which then automatically mix and polymerize to seal the delamination without external intervention
2Ease of manufacture
If the molding compound is heated above its melting point during application, then it can be properly applied and bonded to the die, but this thermal stress contributes to delamination between components
Solution Approach 1:
The repair substance is applied to the die before the molding compound is applied and heated. This ensures that the repair material is in place before the thermal stress of molding occurs, so it can activate and seal any delamination that happens during the molding process
3Productivity
If the die is diced from the wafer, then individual integrated circuits can be packaged, but the edges and corners of the die are more susceptible to stress and delamination
Solution Approach 1:
The repair substance is selectively applied to specific locations on the die, particularly at edges and corners where delamination is most likely to occur due to stress concentration. This localized application provides targeted protection where it is most needed without affecting the entire die surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides site-specific autonomic healing, extending the lifespan of the integrated circuit by maintaining the integrity of the package and preventing moisture ingress and short circuits, thus ensuring the functionality and reliability of the semiconductor die.
Implementation Method 1
The microcapsules contain a liquid sealing agent or sealing compound. When the microcapsules break, the liquid sealing agent comes out and mixes with the catalyst. When the sealing agent mixes with the catalyst, the sealing agent polymerizes and bonds to the molding compound and the die.
Data Source
AI summary
An integrated circuit package comprises a molding compound covering a semiconductor die. A healing substance is on the surface of the semiconductor die at an interface of the molding compound and the semiconductor die. The healing compound comprises a catalyst and a plurality of microcapsules containing a sealing compound. If the molding compound becomes delaminated from the semiconductor die the microcapsules rupture and spill the sealing compound. When the sealing compound is spilled and contacts the catalyst the sealing compound and catalyst polymerize and fasten the molding compound to the semiconductor die.