Self-Shielded Die EMI Shielding via Integrated Substrate
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Solution Overview
Problem
Conventional RF wireless communication devices face challenges in providing effective EMI shielding without increasing device size, as internal shields require additional space and are complex to fabricate, especially with the trend of adding more frequency bands and tightening filter performance requirements.
Innovation Solution
The implementation of self-shielded dies with integrated EMI shields formed from conductive materials applied directly to the surfaces and sides of the dies, creating a Faraday cage effect, which allows for precise and uniform shielding at the wafer level before package assembly, eliminating the need for additional space and simplifying the fabrication process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If internal shields (wirebond loops, metal filled trenches, wire mesh) are added to shield against electromagnetic radiation, then EMI protection is improved, but device size increases and fabrication complexity increases
Solution Approach 1:
The patent combines the substrate and EMI shield into a single integrated structure. The substrate itself is configured with conductive patterns and ground layers that provide EMI shielding functionality, eliminating the need for separate internal shield components. This merging reduces device size while maintaining EMI protection.
Solution Approach 2:
The substrate is designed to serve multiple functions simultaneously: it provides mechanical support for electronic devices, electrical connections through conductive patterns, and EMI shielding through its conductive structure and ground layers. This multi-functionality eliminates the need for dedicated shield components.
2Reliability
If internal shields (wirebond loops, metal filled trenches, wire mesh) are added to shield against electromagnetic radiation, then EMI protection is improved, but fabrication complexity increases
Solution Approach 1:
The substrate and EMI shield are merged into one component, reducing fabrication complexity. The conductive patterns and ground layers are formed using standard PCB manufacturing processes, eliminating the need for complex assembly steps required for separate internal shields.
Solution Approach 2:
The EMI shielding functionality is built into the substrate during its manufacturing process, before electronic devices are mounted. The conductive patterns and ground layers are pre-formed on the substrate, providing EMI protection from the outset without requiring additional fabrication steps later.
3Adaptability or versatility
If more frequency bands are added to wireless communication devices, then communication capability is improved, but EMI shielding requirements become more critical and device size increases
Solution Approach 1:
The integrated substrate-shield structure provides universal EMI protection that works across multiple frequency bands. The conductive patterns and ground layers are designed to shield against a broad spectrum of electromagnetic frequencies, supporting devices with multiple transmit and receive bands without requiring frequency-specific shields.
Solution Approach 2:
The substrate and shield are combined into a single component that supports multiple frequency bands. This integration allows the device to handle multiple frequency bands simultaneously without increasing size, as the unified structure provides comprehensive EMI protection across the entire frequency spectrum.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables effective shielding against both external and internal electromagnetic radiation with reduced space requirements and improved precision, allowing for more compact and efficient RF wireless communication devices that can handle multiple frequency bands simultaneously.
Implementation Method 1
an EMI shield formed of at least one electrically conductive material and connected to ground... substantially completely covering a top surface of the substrate... and further substantially completely covering all sides of the substrate, extending between the top surface of the substrate and the bottom surface of the substrate
Data Source
AI summary
A self-shielded die includes a substrate, an electronic device attached to the substrate, one or more electrical pads disposed on a bottom surface of the substrate, and an electromagnetic interference (EMI) shield formed of at least one electrically conductive material and connected to ground. At least one of the one or more electrical pads is electrically connected to the electronic device. The EMI shield includes a top shield layer, disposed directly on and substantially completely covering a top surface of the substrate opposite the bottom surface of the substrate, and side shield layers substantially completely covering all sides of the substrate, extending between the top surface of the substrate and the bottom surface of the substrate.