Self-Shielding Coaxial Capacitor Structures for High-Frequency Circuits
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Solution Overview
Problem
Capacitors in high-frequency circuit applications suffer from electromagnetic interference and fringe losses due to the lack of shielding and parasitic capacitances, which degrade their performance.
Innovation Solution
The development of self-shielding coaxial capacitor structures with coaxially arranged electrodes and a central vertical pillar, where the magnetic fields generated circumscribe the pillar, reducing mutual inductances and parasitic capacitances, and maintaining electric and magnetic fields within the dielectric, thereby providing effective shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional capacitor structures are used in high-frequency applications, then the capacitor can be manufactured with standard processes, but electromagnetic interference from neighboring components and fringing losses degrade performance
Solution Approach 1:
A magnetic shielding layer is introduced as an intermediary component between the capacitor and external electromagnetic environment. This shielding layer, positioned adjacent to the dielectric, acts as a mediator that captures and redirects magnetic field lines, preventing external electromagnetic interference from reaching the capacitor while also containing the capacitor's own magnetic fields to reduce fringing losses.
2Loss of energy
If high conductivity electrodes and low loss dielectrics are used to mitigate fringing losses, then losses within the device are reduced, but the solution has limited application in multilayer ceramic capacitor construction
Solution Approach 1:
The magnetic shielding layer serves as an intermediary that addresses fringing losses without requiring changes to the fundamental multilayer ceramic capacitor manufacturing process. By positioning the shielding layer externally adjacent to the dielectric, the invention reduces energy losses through magnetic field containment while maintaining compatibility with standard MLCC fabrication techniques.
3Object-affected harmful factors
If shielding structures are added to capacitors, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The magnetic shielding layer is implemented as a thin film or flexible shielding structure that can be integrated into the capacitor assembly without significantly increasing overall device complexity. This thin-film approach provides effective electromagnetic shielding while maintaining a compact form factor and minimal impact on the capacitor's physical footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the Q factor of capacitors by reducing fringe losses and parasitic capacitances, improving their performance and shielding properties, and minimizing interference from neighboring components.
Implementation Method 1
the magnetic fields generated encircle the inner conductor
Implementation Method 2
self-shielding capacitor structures... providing effective shielding
Implementation Method 3
coaxial capacitor structures... multilayer capacitor structures
Data Source
AI summary
Methods and devices related to fabrication and utilization of multilayer capacitors presenting coaxially arranged electrode layers. The capacitors may be self-shielded against electromagnetic interference with neighboring components. The capacitors may have reduced losses from fringing effects when compared to conventional capacitors. The coaxial capacitors may be two-terminal multilayer ceramic capacitors (MLCC). The design of the capacitors may facilitate an improved relationship between the electric and magnetic fields generated by the capacitor within the dielectric in some embodiments. In some embodiments, the placement of the terminals may lead to a cancelation of mutual inductances between the electrodes. Terminations that facilitate the coupling of the capacitor to a circuit board, as well as methods for fabrication of the capacitors are also discussed.