Self-Verifying Modular Assembly for Micron-Level Module Alignment
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Solution Overview
Problem
Challenging and time-consuming process of verifying accurate alignment between modules in semiconductor manufacturing systems, particularly in obscured or difficult-to-access regions, reduces productivity and increases costs.
Innovation Solution
A modular assembly comprising two modules with engagers and verification circuits that ensure precise alignment, allowing modules to engage and verify electrical connection, facilitating accurate alignment within a few microns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional alignment verification methods are used, then alignment accuracy can be achieved, but the process becomes time-consuming and reduces productivity
Solution Approach 1:
The patent incorporates alignment verification features directly into the module engagement mechanism itself, so that verification occurs automatically during the engagement process rather than as a separate subsequent step. The engagement features are designed to inherently provide alignment verification, eliminating the need for additional time-consuming measurement or verification steps after modules are assembled.
Solution Approach 2:
The module engagement mechanism is designed to self-verify alignment through its own structure. The engagement features automatically indicate whether modules are correctly aligned and engaged without requiring external measurement devices or additional verification processes. The system serves its own alignment verification needs through the engagement mechanism itself.
2Manufacturing precision
If traditional alignment verification methods are used, then alignment accuracy can be achieved, but costs increase
Solution Approach 1:
The alignment verification capability is built into the module design from the beginning, with verification features integrated into the engagement mechanism. This eliminates the need for separate verification equipment or processes, reducing overall system cost while maintaining alignment accuracy.
Solution Approach 2:
The engagement mechanism itself provides alignment verification without requiring additional external systems or processes. This self-verifying capability reduces the need for expensive separate measurement and verification equipment, thereby lowering overall manufacturing and operational costs.
3Manufacturing precision
If alignment verification is performed in obscured or difficult-to-access regions, then alignment accuracy can be verified, but the process becomes more difficult and time-consuming
Solution Approach 1:
The patent extracts the alignment verification function from obscured or difficult-to-access regions and incorporates it directly into the module engagement features, which are located at accessible interfaces. The verification capability is moved from hidden internal regions to the engagement interfaces where modules connect, making verification easily accessible without requiring disassembly or special access procedures.
Solution Approach 2:
The engagement features serve as intermediaries that provide alignment verification at accessible locations. Rather than directly observing or measuring alignment in obscured internal regions, the verification is performed through the engagement interfaces, which act as mediators between the internal alignment state and external observation points.
Data Source
AI summary
The present disclosure relates to modular assembly for engaging modules of an apparatus together. The assembly comprising two modules configured to be mutually engageable to adjoin each other. The modules each having a body and multiple engagers that are each configured to engage with a corresponding engager of another of the modules and to complete a corresponding verification circuit. Each verification circuit is configured to be closed on engagement of an engager of one of the modules with a corresponding engager of the other of the modules. The engager is configured to be electrically isolated from the body of the one of the two modules, and the corresponding engager is configured to be electrically connected to the body of the other of the two modules.