Self-healing PDMS Encapsulation for Power Module ESD Protection
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Solution Overview
Problem
Conventional support structures and bonding materials in semiconductor assemblies are prone to cracking or fracturing due to mechanical and thermal stresses, leading to reduced functionality or complete failure, especially in high-voltage electronics susceptible to electrostatic discharge (ESD).
Innovation Solution
A self-healing power electronics assembly utilizing a polydimethylsiloxane-based polyurethane (PDMS-PU) polymer modified with disulfide bonds, which can autonomously repair damage and confine heat to edge regions prone to ESD, providing enhanced thermal stability and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional support structures and bonding materials are used in semiconductor assemblies, then the assembly can be manufactured with standard materials and processes, but the structures are prone to cracking or fracturing due to mechanical and thermal stresses, leading to reduced functionality or complete failure
Solution Approach 1:
The patent modifies the chemical composition of the polymer by incorporating disulfide bonds into the PDMS-PU structure. This parameter change enables the material to dynamically reconfigure its molecular network in response to stress, allowing it to heal cracks and maintain structural integrity under thermal and mechanical cycling conditions that would cause conventional materials to fail
Solution Approach 2:
The patent creates a composite material system by combining PDMS-PU polymer with disulfide bond functional groups. This composite structure integrates the flexibility and thermal stability of PDMS with the self-healing capability provided by disulfide bonds, resulting in a material that simultaneously achieves high reliability and resistance to cracking
2Ease of manufacture
If standard dielectric gel insulation is used in high voltage electronics, then the assembly can be manufactured with conventional materials, but erosion of internal areas by voids can initiate a runaway breakdown process
Solution Approach 1:
The patent changes the material parameters by replacing standard dielectric gel with PDMS-PU modified with disulfide bonds. This modification provides superior void-filling properties and erosion resistance while maintaining ease of manufacture through conventional encapsulation processes, preventing the initiation of runaway breakdown in high voltage applications
Solution Approach 2:
The patent employs a self-healing polymer that can autonomously repair damage from ESD events and thermal cycling. This material effectively replaces multiple conventional insulation layers and repair operations with a single encapsulation material that maintains its protective function throughout the device lifecycle, reducing long-term maintenance requirements
3Object-affected harmful factors
If frame components are designed to confine heat to edge regions, then ESD damage can be reduced at vulnerable edges, but heat management becomes more complex and may affect overall thermal distribution
Solution Approach 1:
The patent applies local quality by designing the frame component with differentiated thermal properties at different locations. The frame structure confines heat to edge regions where ESD susceptibility is highest, while allowing other areas to maintain normal thermal distribution. This localized heat management approach targets protection where needed without requiring complete redesign of the overall thermal system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The self-healing polymer effectively minimizes and repairs damage from ESD, maintaining the integrity and performance of electronic components by restoring mechanical properties and redirecting waste heat, thus preventing further ESD failures and extending the lifespan of power electronics assemblies.
Implementation Method 1
A self-healing polymer comprising disulfide bonds... may include polydimethylsiloxane based polyurethane (PDMS-PU) modified with disulfide bonds
Implementation Method 2
The frame component may be configured to confine heat to edge regions of the semiconductor electronics device where ESD may be problematic
Implementation Method 3
providing enhanced thermal stability and electrical insulation
Data Source
AI summary
A power electronics assembly is provided with a self-healing feature. The power electronics assembly may include a semiconductor electronics device and an insulating substrate coupled to the semiconductor electronics device. A base metal structural component may be provided, coupled to the insulating substrate. The assembly may include a frame component cooperating with the base metal structural component and defining an enclosure containing the semiconductor electronics device and the insulating substrate. The assembly further includes a self-healing polymer comprising disulfide bonds. The self-healing polymer is disposed within the enclosure; additional potting material may also be provided as a multi-layered encapsulation. In various aspects, the self-healing polymer may include polydimethylsiloxane based polyurethane (PDMS-PU) modified with disulfide bonds. The frame component may be configured to direct or confine heat to areas of the assembly where ESD may be problematic.