SEM-Based Structure Height Estimation for Semiconductor Foreign Matter

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Solution Overview

Problem

Existing methods for measuring the height of foreign matter on semiconductor devices are inefficient and inaccurate, particularly in high-throughput semiconductor manufacturing, as they require labor-intensive AFM measurements and struggle to handle the varied shapes and compositions of unintentionally adhering foreign matter.

Innovation Solution

A structure estimation system using a learning device that performs advanced learning with teacher data from charged particle beam devices to estimate the three-dimensional information of foreign matter and its influence on semiconductor structures, utilizing neural networks and other learning models to process SEM data for accurate height estimation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If AFM measurement is used to measure the height of foreign matter, then measurement precision is improved, but productivity deteriorates due to labor-intensive manual measurement

Engineering Contradiction:
Improveheight measurement precisionVSAvoidmeasurement throughput
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The patent creates a virtual three-dimensional model (copy) of the foreign matter based on two-dimensional SEM images. The learning device generates a depth map that represents the three-dimensional shape without requiring physical contact measurement, thereby eliminating the need for manual AFM measurement while maintaining measurement capability through digital modeling

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent replaces the mechanical AFM measurement system with a computational approach using SEM images and machine learning. Instead of using physical probes to measure height, the system uses image processing and neural networks to estimate three-dimensional information from two-dimensional images, substituting mechanical measurement with computational analysis

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of operation

If a library is prepared in advance to store cross-sectional shape information, then ease of operation is improved, but adaptability deteriorates due to difficulty in generating libraries for various foreign matter shapes and compositions

Engineering Contradiction:
Improvemeasurement operation simplicityVSAvoidforeign matter shape variety
Core Design Contradiction:
Ease of operationVSAdaptability or versatility

Solution Approach 1:

The patent creates a universal learning device that can handle various foreign matter shapes and compositions through a single system. The neural network is trained on diverse data and can generalize to different foreign matter types without requiring separate libraries for each shape or composition, making the system both easy to operate and highly adaptable

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent changes the approach from storing fixed library data to using a learning device that can adapt its parameters (weights and biases in neural network) based on input data. The system dynamically adjusts its estimation based on the specific characteristics of each foreign matter instance, allowing it to handle various shapes and compositions without pre-defined libraries

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If cross-sectional SEM or AFM is used for height measurement, then measurement precision is improved, but device complexity increases and productivity decreases

Engineering Contradiction:
Improveheight measurement precisionVSAvoidmeasurement device complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent creates a virtual three-dimensional model (copy) of the foreign matter based on two-dimensional SEM images. The learning device generates a depth map that represents the three-dimensional shape without requiring physical contact measurement, thereby eliminating the need for manual AFM measurement while maintaining measurement capability through digital modeling

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent merges the foreign matter inspection function with the existing SEM imaging system. Instead of using separate AFM or cross-sectional SEM devices, the system combines height estimation capabilities with the standard SEM, allowing the same device to perform both imaging and three-dimensional measurement functions

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS12561823B2Structure estimation system and structure estimation program for estimating height of structure based on data from charged particle beam device
Publication Date: 2026.02.24 HITACHI HIGH TECH CORP
  • US12561823B2 patent drawing
  • US12561823B2 patent drawing
  • US12561823B2 patent drawing

AI summary

The present disclosure relates to a system and a non-transitory computer-readable medium for estimating the height of foreign matter, etc. adhering to a sample. In order to achieve the abovementioned purpose, proposed is a system, etc. in which data acquired by a charged particle beam device or features extracted from the data are input to a learning model, which is provided with, in an intermediate layer thereof, a parameter learned using teacher data having data acquired by the charged particle beam device or features extracted from the data as inputs and having the heights or depths of the structures of samples or of foreign matter on the samples as outputs, and height or depth information is output.