SEM Layout Matching for Fast Semiconductor Defect Detection

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Solution Overview

Problem

The increasing complexity of semiconductor manufacturing processes leads to defects such as unintended patterns, which can severely impact semiconductor devices, necessitating more accurate and efficient defect detection methods.

Innovation Solution

A system and method utilizing a processor to convert SEM images into image layouts, perform layout matching, and detect defects by overlapping design and image layouts, employing algorithms like noise reduction, segmentation, and stochastic gradient descent for enhanced accuracy and speed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional defect detection methods are used in complex semiconductor manufacturing processes, then detection coverage is maintained, but detection speed and accuracy deteriorate due to process complexity and defect variety

Engineering Contradiction:
Improvedefect detection accuracyVSAvoidsemiconductor manufacturing process complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent segments the defect detection process into distinct modules: image acquisition module, image processing module (with noise reduction, enhancement, and segmentation sub-steps), layout generation module, and defect detection module. This segmentation allows each module to specialize in specific tasks, improving overall detection accuracy while managing the complexity of semiconductor manufacturing process analysis

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces an intermediary image processing step that converts raw SEM images into processed images with enhanced features and reduced noise. This intermediary processing layer acts as a mediator between the complex manufacturing process data and the defect detection algorithm, improving detection accuracy by presenting cleaner, more relevant features to the detection module

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If comprehensive defect detection is performed across all semiconductor patterns, then detection accuracy is maintained, but detection time increases significantly

Engineering Contradiction:
Improvedefect detection reliabilityVSAvoiddefect detection time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent performs preliminary image processing operations including noise reduction, image enhancement, and pattern segmentation before the actual defect detection. By preparing the images in advance with these preliminary steps, the subsequent defect detection can proceed more efficiently without compromising reliability, as the data is already optimized for analysis

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies image processing and defect detection selectively to regions of interest identified through preliminary analysis, rather than uniformly processing entire semiconductor wafers. This partial action approach maintains detection reliability for critical areas while reducing overall detection time by focusing computational resources where defects are most likely to occur

Inventive Principle:
Principle #16Partial or excessive action

3Measurement precision

If detailed image processing is applied to SEM images, then defect detection accuracy improves, but processing complexity and computational requirements increase

Engineering Contradiction:
Improvedefect detection precisionVSAvoidimage processing complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The image processing function is segmented into distinct operational steps: noise reduction processing, image enhancement processing, and pattern segmentation. Each segment handles a specific aspect of image refinement, improving defect detection precision while managing computational complexity through modular, specialized processing stages rather than a single complex algorithm

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent extracts and removes noise components from SEM images through dedicated noise reduction processing before proceeding to defect detection. By taking out the harmful noise elements separately, the system improves detection precision without needing to handle noise within the main detection algorithm, thereby managing processing complexity more effectively

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS12555222B2System and method for detecting defects
Publication Date: 2026.02.17 SAMSUNG ELECTRONICS CO LTD
  • US12555222B2 patent drawing
  • US12555222B2 patent drawing
  • US12555222B2 patent drawing

AI summary

A system for detecting defects includes a memory configured to store a program of instructions; and a processor configured execute the program of instructions to convert an SEM image into an image layout, determine a search space based on performing first layout matching for the image layout and a design layout, match the image layout and the design layout based on performing the second layout matching in the search space, and output defect information based on detecting defects the matched image layout and the matched design layout. The SEM image is an image obtained based on photographing a semiconductor pattern formed on a semiconductor wafer using the design layout based on using a scanning electron microscope.