Disposable SEM Sensor Attachment Without Adhesives or Frame Lips
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Solution Overview
Problem
Existing medical devices for measuring sub-epidermal moisture (SEM) face challenges in securely attaching printed circuit boards (PCBs) without using adhesives or lips, which can be cumbersome and limit flexibility in device design.
Innovation Solution
A detachable element with a body comprising an upper and lower section joined by a flexible arm, featuring a printed film with tabbed and non-tabbed areas, and a sensor with electrodes, is designed for attachment to a device, along with a connector that includes a retention groove and electrical contact surface, allowing for secure and flexible attachment to a reusable component without adhesives or lips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PCBs are retained in device frames by adhesive or lip structures, then secure attachment is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts the attachment function from the frame structure itself by using a separate retention feature that can be inserted into the frame. This retention feature carries both the PCB and electrical contacts, separating the attachment mechanism from the frame and simplifying the overall device structure while maintaining secure attachment.
Solution Approach 2:
The patent introduces a retention feature as an intermediary component between the frame and the PCB. This retention feature serves as a mediator that provides both mechanical support and electrical connection, eliminating the need for complex frame structures or adhesive applications while ensuring reliable attachment.
2Reliability
If adhesive or lip structures are used to attach PCBs, then attachment is achieved, but ease of manufacture and assembly are reduced
Solution Approach 1:
The patent segments the attachment system into a removable retention feature that can be independently manufactured and assembled. This segmentation allows the retention feature to be pre-assembled with the PCB and electrical contacts, then easily inserted into the frame as a single unit, significantly improving ease of manufacture and assembly compared to integrating attachment structures into the frame itself.
3Stability of the object's composition
If fixed PCB attachment structures are used, then structural stability is achieved, but device flexibility and adaptability are reduced
Solution Approach 1:
The patent implements a dynamic attachment system where the retention feature can be easily inserted into and removed from the frame. This dynamic design maintains structural stability during use while allowing flexible reconfiguration, replacement, or adaptation of the PCB and electrical contact assembly, thereby enhancing device versatility without compromising structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables secure and flexible attachment of PCBs in medical devices, enhancing device design flexibility and functionality for SEM measurement without the need for adhesives or lips.
Implementation Method 1
The lower section is attached on its underside to a compressible spring
Implementation Method 2
a sensor comprising two electrodes on its first face
Data Source
Figure 1A~3
Figure 4~6
Figure 7A~7B
AI summary
The construction of a medical device having a disposable element is disclosed. Detachable elements comprising a body having a retention feature, an electrical contactor, and sensors are also disclosed. Further disclosed are detachable elements comprising a body having a hole and a retention pocket, an electrical contactor, and a printed circuit board assembly (PCB) in contact with the innermost surface of the body that forms the retention pocket. Further disclosed are detachable elements comprising a body having an opening and a printed film comprising conductive elements, where the conductive elements comprise a sensor configured to be aligned with the opening to expose the sensor. Further disclosed are reusable components having matching retention features.