Semi-Cured Adhesive Layer for Flat Digitizer Surface
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Solution Overview
Problem
Flexible display devices with digitizer layers for touch input detection often have uneven protective films due to circuit wiring, causing recognition issues under high-intensity light exposure.
Innovation Solution
A display device design where the digitizer layer is adhered to the back surface of a panel protective film using a semi-cured adhesive layer, which is formed by coating an adhesive material containing vinylsilane and hydrosilane and irradiating ultraviolet rays, and includes a reaction retarder to maintain a flat surface even with stepped electrode patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the protective film is disposed directly on the digitizer layer with stepped electrode patterns, then the manufacturing process is simple, but the protective film surface becomes uneven and visible under high-intensity light
Solution Approach 1:
A buffer layer is introduced as an intermediary between the digitizer layer with stepped electrode patterns and the protective film. This buffer layer fills the stepped portions and provides a flat upper surface, allowing the protective film to be disposed on a flat surface without exposing the underlying electrode pattern irregularities. The buffer layer acts as a mediator that decouples the uneven lower interface from the upper surface flatness requirement.
2Strength
If the adhesive layer is fully cured to provide strong bonding, then the bonding strength is high, but the surface becomes rigid and cannot fill unevenness
Solution Approach 1:
The adhesive layer is designed to exhibit dynamic mechanical properties, being in a semi-cured state during the assembly process to maintain flexibility and fill unevenness, then transitioning to a fully cured state for strong bonding. This dynamic state change allows the adhesive to adapt to surface irregularities initially, then provide rigid structural support after curing.
Solution Approach 2:
The degree of curing of the adhesive layer is controlled as a key parameter. By adjusting the curing extent from semi-cured to fully cured, the adhesive layer's properties change from flexible and conformable to rigid and strong. This parameter control allows optimization of both surface flatness and bonding strength at different stages of the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents the recognition of uneven protective film shapes caused by digitizer layer wiring, enhancing display quality and allowing for easy bending and folding without surface irregularities.
Implementation Method 1
a first adhesive layer, configured to adhere the digitizer layer to the back surface of the panel protective film, wherein the first adhesive layer is a semi-cured adhesive layer
Implementation Method 2
the adhesive layer is disposed between the display panel and the digitizer layer and containing SiOCH3CH3—CH2—CH2—SiCH3OCH3OCH3
Data Source
AI summary
The present disclosure relates generally to a display device. According to one aspect of the present disclosure, a display device includes: a display panel configured to display an image on its front surface, a digitizer layer disposed on a back surface of the display panel and configured to generate a magnetic field by first electrode patterns and second electrode patterns, and an adhesive layer disposed between the display panel and the digitizer layer and containing SiOCH3CH3—CH2—CH2—SiCH3OCH3OCH3.