Semi-Cured Laminate Structure for Thin, High-Strength PCB Substrates
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Solution Overview
Problem
Existing methods for producing thin and high-strength laminates for printed wiring boards and multilayer coreless substrates face challenges in thickness reduction and mechanical strength, particularly when using prepregs and resin sheets, which either lack sufficient strength or are prone to void formation due to thickness variations.
Innovation Solution
A laminate structure comprising a heat-resistant film layer with resin composition layers in a semi-cured state, having a specific thickness difference range, ensures close contact and high mechanical strength, allowing for the production of thin and high-strength metal foil-clad laminates with high-density fine wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If prepregs or resin sheets are used for insulating resin layer formation, then the laminate can be produced, but the thickness reduction is limited and mechanical strength is insufficient
Solution Approach 1:
The invention changes the physical state parameter of the resin from fully cured (in prepregs and resin sheets) to semi-cured (B stage). This parameter change allows the resin to maintain flexibility and adaptability during lamination while achieving superior mechanical strength in the final cured state, thereby resolving the contradiction between thickness reduction and strength enhancement.
Solution Approach 2:
The invention creates a composite structure by combining the heat-resistant film base material with the semi-cured resin composition layer. This composite material approach allows the thin film structure to achieve both reduced thickness and enhanced mechanical strength, as the semi-cured resin provides structural integrity while the film provides the thin profile.
2Length of moving object
If resin sheets with semi-cured resin composition layer are used, then thickness reduction is achieved, but the resin composition layer merely contacts the heat-resistant film without sufficient bonding
Solution Approach 1:
The invention applies preliminary action by forming the resin composition layer in a semi-cured state (B stage) before final lamination. This preliminary curing stage allows the resin to develop initial adhesion properties and structural integrity, ensuring reliable close contact with the heat-resistant film during the lamination process, while still maintaining the thin profile advantage.
3Device complexity
If existing production apparatuses are used without support substrates, then the production process is simplified, but the printed wiring boards are broken or wound around conveyers
Solution Approach 1:
The invention applies beforehand cushioning by using the semi-cured resin composition layer as a protective medium during the lamination process. The semi-cured state provides temporary mechanical support and cushioning to the thin structure, preventing breakage and deformation during handling and conveyance in existing production apparatuses, without requiring additional support substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed laminate structure enables the production of thin, high-strength printed wiring boards and multilayer coreless substrates with improved mechanical strength and reduced void formation, suitable for semiconductor devices, without requiring thick support substrates.
Implementation Method 1
a laminate comprising a first resin composition layer, a heat-resistant film layer, and a second resin composition layer laminated in the presented order
Implementation Method 2
ensures close contact and high mechanical strength
Data Source
AI summary
Provided is a laminate containing a first resin composition layer, a heat-resistant film layer, and a second resin composition layer laminated in the presented order, wherein the first resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the first resin composition layer is 0.5 to 5 μm; and the second resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the second resin composition layer is 0.5 to 5 μm.