Semi-Cured Resin Support for Thin Substrate Handling
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Solution Overview
Problem
As semiconductor device substrates continue to thin, handling properties deteriorate, making it difficult to mount semiconductor devices effectively.
Innovation Solution
A support comprising a heat-resistant film layer laminated on a semi-cured resin layer, with a copper foil on the opposite side, enhances handling properties by improving the substrate's stiffness and adhesion, allowing for easier semiconductor device mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If substrate thickness is reduced to achieve thinner package substrates, then substrate thinning is achieved, but handling properties deteriorate
Solution Approach 1:
The patent applies composite materials by combining a semi-cured resin layer with a heat-resistant film layer to create a support structure. This composite construction provides enhanced mechanical strength and handling properties while maintaining the thin profile of the substrate, directly resolving the contradiction between substrate thinning and handling properties.
Solution Approach 2:
The patent utilizes parameter changes by controlling the curing state of the resin layer to a semi-cured condition (B-stage). This intermediate state provides optimal balance between flexibility for handling and structural integrity, allowing the thin substrate to maintain good handling properties during manufacturing processes.
2Volume of moving object
If substrate thickness is reduced to achieve thinner package substrates, then substrate thinning is achieved, but semiconductor device mounting becomes difficult
Solution Approach 1:
The composite structure of semi-cured resin layer plus heat-resistant film provides sufficient mechanical support for semiconductor device mounting operations. The heat-resistant film acts as a reinforcement layer that enables proper handling and mounting processes even on substrates with thickness of 60 μm or less.
Solution Approach 2:
By controlling the resin layer to a semi-cured state, the patent achieves optimal mechanical properties that facilitate semiconductor device mounting. The semi-cured state provides adequate rigidity for mounting operations while maintaining the thin substrate structure.
3Ease of operation
If support stiffness is increased to improve handling properties, then handling properties improve, but substrate flexibility may be reduced
Solution Approach 1:
The composite structure combines materials with complementary properties: the semi-cured resin layer provides flexibility and adhesion, while the heat-resistant film layer provides stiffness for handling. This combination achieves both improved handling properties and maintained substrate flexibility.
Solution Approach 2:
The support structure applies local quality by having different layers serve different functions: the heat-resistant film provides localized stiffness where needed for handling, while the semi-cured resin layer maintains overall flexibility and bonding capability throughout the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The support significantly improves the handling properties of thin semiconductor device substrates, enabling easier mounting and application of solder resist, thereby facilitating the production of reliable semiconductor device-mounting substrates.
Implementation Method 1
a resin layer, wherein the resin layer is in a semi-cured state (B stage)
Implementation Method 2
a heat resistant film layer
Data Source
AI summary
A support including a heat resistant film layer and a resin layer, wherein the heat resistant film layer is laminated on at least one side (a first side) of the resin layer, and the resin layer is in a semi-cured state (B stage).