Semi-Embedded Connection Stem for Dense Microelectronic Assembly
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Solution Overview
Problem
Current microelectronic device assembly techniques face challenges in forming mechanically and electrically optimized connection elements, particularly with high insertion force requirements and limited connection density due to the complexity of microelectronic systems and the difficulty in reducing the pitch of connection elements.
Innovation Solution
The development of microelectronic devices with electrically conductive rods that have a buried portion in an inorganic anchoring portion, providing enhanced mechanical resistance, and a projecting portion for insertion into complementary pads, allowing for controlled manufacturing and improved assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional insertion technology with fully projecting rods is used, then mechanical connection is achieved, but mechanical resistance is insufficient and insertion force is too high
Solution Approach 1:
The rod is segmented into two distinct portions: a buried portion embedded in the dielectric layer for mechanical anchoring, and a projecting portion extending from the surface for electrical connection. This segmentation allows each portion to be optimized for its specific function, with the buried portion providing mechanical strength and the projecting portion enabling low-force insertion into complementary pads.
2Quantity of substance
If the pitch of connection elements is reduced to increase connection density, then connection density improves, but manufacturing precision becomes more difficult to achieve
Solution Approach 1:
The rods are preliminarily formed with embedded portions in the dielectric layer before the final assembly process. This preliminary action establishes precise positioning and mechanical anchoring in advance, allowing subsequent pitch reduction and high-density arrangement without compromising manufacturing precision, as the embedded portions serve as fixed reference points during assembly.
3Strength
If rods are made to strictly project from the surface for connection, then electrical connection is simplified, but mechanical resistance is reduced
Solution Approach 1:
The invention merges the mechanical anchoring function and the electrical connection function into a single integrated rod structure. The buried portion provides mechanical anchoring while the projecting portion enables electrical connection, combining both functions in one element rather than requiring separate mechanical and electrical connection components.
Data Source
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AI summary
The invention relates to a system provided with a microelectronics device comprising a substrate (100) exposed on one face of the device, the substrate (100) comprising at least one electrically conducting element (105) and an electrical connection member (130) in electrical continuity with the element (105) and comprising at least a stem (116) projecting from the face of the device, characterized in that the connecting member (130) comprises an inorganic anchoring portion (131) covering the element (105) and in that the stem (116) comprises a portion (1161) embedded in the anchoring portion (131) followed by a portion (1162) projecting on the face of the device.