Semi-fixing Member Height Compensation in Semiconductor Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor devices, height mismatches between control signal terminals and power terminals can lead to inadequate connections, causing cracks and operational interference due to thermal expansion and contraction, which existing technologies fail to adequately address.
Innovation Solution
A semiconductor device design featuring a semi-fixing member with a shank portion that penetrates through a through hole in the control circuit board, where the shank portion is smaller than the hole, and an end portion that is larger, allowing for relative movement and compensation of height differences between the control circuit board and power terminal holder, ensuring proper connection to the semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid fixing structures are used to ensure stable connection, then connection stability is improved, but height mismatch between terminals cannot be compensated, leading to connection failures and thermal stress cracks
Solution Approach 1:
The fixing member is designed with a two-stage structure: a shank portion that can move vertically within the through hole to compensate for height differences, and an end portion that provides stable anchoring. This dynamic structure allows the fixing member to adapt to height variations while maintaining reliable connection, resolving the contradiction between connection stability and height mismatch compensation.
Solution Approach 2:
The fixing member is segmented into functionally distinct parts: the shank portion (with smaller cross-section) for movement and compensation, and the end portion (with larger cross-section) for stable fixation. This segmentation allows each part to perform its specific function optimally, enabling both height compensation and stable connection simultaneously.
2Manufacturing precision
If positioning pins are used to improve horizontal positional accuracy, then alignment precision is improved, but vertical height mismatch between terminals remains unaddressed
Solution Approach 1:
While positioning pins provide rigid horizontal alignment, the fixing member introduces vertical dynamics through its movable shank portion. This allows the system to maintain precise horizontal positioning while adapting to vertical height variations, resolving the contradiction between manufacturing precision and connection reliability.
3Manufacturing precision
If through hole size is reduced to improve precision, then positioning accuracy is improved, but the fixing member cannot accommodate height variations
Solution Approach 1:
The fixing member is segmented with different cross-sectional sizes: the shank portion has a smaller cross-section that fits within the precision through hole, while the end portion has a larger cross-section for stable fixation. This segmentation allows the through hole to maintain small size for precision while the fixing member accommodates height variations through its structured design.
Solution Approach 2:
The shank portion's smaller cross-section allows it to move vertically within the precision through hole, providing dynamic height compensation while maintaining the benefits of a small, precise hole. The end portion's larger cross-section ensures stable anchoring, resolving the contradiction between precision and adaptability.
Data Source
AI summary
A semiconductor device includes: a semiconductor chip mounting substrate, a control circuit board, a power terminal holder and a semi-fixing member. The semiconductor chip mounting substrate includes a substrate, a semiconductor chip provided on a first major surface of the substrate, and a first and second semiconductor chip connection electrodes. The control circuit board is provided generally in parallel to the first major surface and includes a control circuit, a control signal terminal connected to the control circuit, and a through hole extending in a direction generally perpendicular to the first major surface. The power terminal holder is provided on opposite side of the control circuit board from the semiconductor chip mounting substrate and includes a power terminal. The semi-fixing member includes a shank portion and an end portion. The shank portion is fixed to the power terminal holder and penetrates through the through hole. A cross section of the shank portion in a plane orthogonal to the extending direction of the through hole is smaller than a size of the through hole. The end portion is connected to a tip of the shank portion. A cross section of the end portion in the plane is larger than the size of the through hole. The first semiconductor chip connection electrode is connected to a first terminal of the semiconductor chip and the control signal terminal. The second semiconductor chip connection electrode is connected to a second terminal of the semiconductor chip and the power terminal.