Semi-Flexible Eutectic Bonder Piece Arrangement for Wafer Alignment
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Solution Overview
Problem
Traditional eutectic bonding techniques face issues with wafer misalignment and bonder warping due to thermal expansion, as either all fixed or all flexible bonder pieces either cause the bonder to warp or the wafers to shift during heating.
Innovation Solution
Implementing a semi-flexible eutectic bonder piece arrangement with fixed pieces near the clamp location and flexible pieces elsewhere, which secures the insert within the circular frame, maintaining wafer alignment and stability during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If all bonder pieces are made fixed, then structural stability is improved, but thermal expansion causes bonder warping
Solution Approach 1:
The patent applies local quality by differentiating the properties of bonder pieces based on their location. Pieces adjacent to clamp locations are made fixed to provide local stability where wafers are secured, while other pieces are made flexible to accommodate thermal expansion in regions away from clamps, thus preventing overall bonder warping.
Solution Approach 2:
The bonder pieces are segmented into two distinct categories: fixed pieces and flexible pieces. This segmentation allows each type to perform its specific function - fixed pieces maintain positional stability near clamps while flexible pieces absorb thermal stresses elsewhere, resolving the contradiction between stability and warping prevention.
2Shape
If all bonder pieces are made flexible, then thermal expansion is accommodated, but wafer alignment is lost
Solution Approach 1:
By making bonder pieces adjacent to clamp locations fixed while keeping others flexible, the patent ensures that flexibility is provided only where needed for thermal expansion, while maintaining rigidity at critical locations where wafer alignment must be preserved during bonding.
Solution Approach 2:
The segmentation of bonder pieces into fixed and flexible types allows the system to simultaneously achieve thermal expansion accommodation through flexible pieces and wafer alignment maintenance through fixed pieces near clamps.
3Stability of the object's composition
If fixed pieces are placed away from clamp locations, then thermal expansion is restricted, but stress concentration occurs
Solution Approach 1:
The patent applies local quality by strategically placing fixed pieces only adjacent to clamp locations where they are needed for stability, while positioning flexible pieces in other regions to distribute thermal stresses, thereby avoiding stress concentration that would occur if fixed pieces were placed away from clamps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement prevents wafer misalignment and bonder warping, ensuring reliable eutectic bonding by combining the stability of fixed pieces with the flexibility to accommodate thermal expansion.
Implementation Method 1
eutectic bonding may utilize an intermediate metal layer that transforms directly from a solid to a liquid state, or vice versa from a liquid to a solid state, at a specific composition and temperature
Implementation Method 2
during heating, the wafers may become offset due to thermal expansion or the parts of a eutectic bonder may warp due to the heat treatment applied
Data Source
AI summary
In an embodiment, a system includes: a circular frame comprising a first side and a second side opposite the first side, wherein the circular frame comprises an aperture formed therethrough; an insert disposed within the aperture; a first wafer disposed over the insert; a second wafer disposed over the first wafer, wherein both the first wafer and the second wafer are configured for eutectic bonding when heated; two clamps disposed on the first side along the circular frame, wherein the two clamps are configured to contact the second wafer at respective clamp locations; and a plurality of pieces configured to secure the insert within the aperture, the plurality of pieces comprising both fixed and flexible pieces, the plurality of pieces comprising two fixed pieces disposed respectively adjacent to the clamp locations along the second side of the circular frame.