Semi-Insulating Layer Prevents Hot Carrier Trapping in Semiconductor Devices

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Solution Overview

Problem

Semiconductor devices such as diodes and IGBTs experience a decrease in breakdown voltage during reliability tests at room or elevated temperatures due to the generation of 'hot' carriers that are trapped in the insulating layers, leading to a reduction in device performance.

Innovation Solution

The semiconductor device design includes a specific structure with a p− type RESURF region, guard ring regions, and a semi-insulating layer configuration that prevents carrier trapping by directing accelerated carriers into the semi-insulating layer rather than the insulating layer, thereby maintaining the breakdown voltage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional semiconductor device structure with insulating layers is used, then the device can be manufactured with standard processes, but the breakdown voltage decreases during reliability tests due to hot carrier trapping in the insulating layers

Engineering Contradiction:
Improvebreakdown voltageVSAvoidhot carrier trapping
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

A semi-insulating layer is introduced as an intermediary between the insulating layer and the semiconductor layer. This semi-insulating layer acts as a mediator that captures and redirects hot carriers before they can be trapped in the insulating layer, thereby preventing breakdown voltage degradation while allowing the insulating layer to maintain its electrical isolation function

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful hot carriers that would normally cause damage by being trapped in the insulating layer are redirected into the semi-insulating layer. By converting this harmful effect into a beneficial one, the semi-insulating layer absorbs the hot carriers and prevents them from degrading the insulating layer, thus maintaining device reliability

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If the semi-insulating layer is positioned to contact the first region at the first surface, then carrier trapping is prevented and breakdown voltage is maintained, but the device structure becomes more complex

Engineering Contradiction:
Improvebreakdown voltage stabilityVSAvoidlayer configuration
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The semi-insulating layer serves multiple functions simultaneously: it provides electrical isolation, captures and redirects hot carriers, and maintains the structural integrity of the device. By combining these functions in a single layer, the design reduces overall complexity compared to having separate structures for each function

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents the decrease in breakdown voltage by alleviating the electric field bias and preventing ion flow into the semiconductor layer, enhancing the reliability and performance of the semiconductor device.

Implementation Method 1

a semi-insulating layer contacts the first region at the first surface between the second and fourth regions. This configuration effectively prevents the decrease in breakdown voltage by alleviating the electric field bias and preventing ion flow into the semiconductor layer

Methodology Applied
Scientific EffectCarrier acceleration and redirection: Electric Field

Data Source

PatentUS11056557B2Semiconductor device including a semi-insulating layer contacting a first region at a first surface of a semiconductor layer
Publication Date: 2021.07.06 KK TOSHIBA
  • US11056557B2 patent drawing
  • US11056557B2 patent drawing
  • US11056557B2 patent drawing

AI summary

A semiconductor device includes a semiconductor layer on a first electrode. The semiconductor layer includes a first region of a first type, a second region of a second type, a third region of the second type, and a fourth region of the first type. The second region is above the first region. The third region surrounds the second region. The fourth region surrounds the third region. The second electrode includes a first portion above the second region and a second portion surrounding the first portion. The third electrode surrounds the second electrode and is electrically connected to the fourth region. The semi-insulating layer is electrically connected to the second electrode and the third electrode. A first end portion of the first insulating layer is above the third region.