Semi-solid Alloy Thermal Interface Composition for Heat Dissipation
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Solution Overview
Problem
Conventional thermal interface materials face issues such as instability, inconvenient installation, poor thermal and mechanical properties, and complex preparation methods, which hinder effective heat dissipation in electronic components.
Innovation Solution
A semi-solid alloy thermal interface composition is developed, comprising specific atomic percentages of Bi, In, Sn, and other elements, which remains solid at room temperature but melts to form a liquid phase at elevated temperatures, allowing for easy installation and effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid thermal interface materials are used, then thermal conductivity is improved, but installation stability deteriorates due to flow during operation
Solution Approach 1:
The patent changes the physical state parameter of the thermal interface material from purely liquid to semi-solid by adding suspended solid particles (metal oxides, ceramic particles, or solid thermal conductors) to the liquid thermal conductive compound. This parameter change allows the material to maintain high thermal conductivity while gaining structural stability and preventing flow during operation.
Solution Approach 2:
The patent creates a composite thermal interface material by combining a liquid thermal conductive compound with suspended solid particles. The composite structure integrates the high thermal conductivity of the liquid phase with the structural stability and heat dissipation capabilities of the solid phase, resolving the contradiction between thermal performance and installation stability.
2Ease of operation
If solid thermal interface materials are used, then installation convenience is improved, but thermal conductivity deteriorates due to reflow requirements and brittle compound formation
Solution Approach 1:
The patent changes the consistency parameter from solid to semi-solid, creating a material that is soft and pliable at room temperature for easy installation, but becomes more stable under operational conditions. This intermediate state eliminates the need for reflow technologies while maintaining good thermal contact and conductivity.
Solution Approach 2:
The semi-solid composite material provides different local properties: it remains soft and conformable at the application interface for easy installation, while the suspended solid particles provide structural integrity and prevent brittle compound formation in the bulk material during operation.
3Temperature
If composite thermal interface materials are used, then thermal performance is improved, but preparation complexity and material stability deteriorate
Solution Approach 1:
The patent employs a composite structure with a liquid thermal conductive compound as the base and suspended solid particles (metal oxides, ceramic particles, or solid thermal conductors) as the dispersed phase. This composite approach enhances thermal performance while the simple suspension methodology keeps preparation relatively straightforward compared to other composite thermal interface materials.
Solution Approach 2:
The patent optimizes the concentration parameter of suspended particles within specific ranges (metal oxides: 10-50 wt%, ceramic particles: 5-30 wt%, solid thermal conductors: 1-20 wt%) to achieve the desired balance between thermal conductivity enhancement and preparation simplicity, avoiding excessive complexity while maintaining material stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The semi-solid alloy composition achieves easy installation, high thermal conductivity, and low thermal contact resistance, while maintaining stability and preventing significant fluid movement within electronic components.
Implementation Method 1
the semi-solid alloy thermal interface composition is completely solid at a room temperature, and has a liquid content of 0.1 to 70 mol % based on a total mole of 100 mol % of the semi-solid alloy thermal interface composition at a temperature of 40 to 130° C.
Implementation Method 2
when a temperature of the electronic components rises above 40° C., the semi-solid alloy interface heat dissipation composition begins to melt and partially becomes liquid
Data Source
AI summary
A semi-solid alloy thermal interface composition and method for dissipating heat from an electronic component using the same are disclosed in the present disclosure. The semi-solid alloy thermal interface material comprises, based on total atoms of 100 at. %, 0.1-10 at. % of Bi, 20-30 at. % of In, and 65-75 at. % of Sn. In a method for dissipating heat from an electronic component using the semi-solid alloy thermal interface material, the semi-solid alloy thermal interface material is disposed between a chip and a heat sink, wherein the semi-solid alloy thermal interface material is completely solid at a room-temperature, and has a liquid content ranging from 0.1 to 70 mol % based on a total mole of 100 mol % of the semi-solid alloy thermal interface composition at a temperature of 40 to 130° C.