3D Measurement Base Correction Using Semi-Spheroid Scanning
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Solution Overview
Problem
Conventional methods for correcting base distortion in surface analysis, caused by mechanical drift such as thermal drift, are inefficient and require significant skill and time, making it difficult to achieve accurate three-dimensional measurements.
Innovation Solution
A method for specifying base points using a semi-spheroid figure that moves only in the X-Y plane, allowing for automatic generation of a highly accurate three-dimensional measurement base by adjusting parameters to ensure the base points are not set higher than the peak, applicable to various surface profiles including peaks and valleys.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual correction processing is performed by specifying correction points, then base distortion can be corrected, but it requires much skill and takes a lot of time and effort
Solution Approach 1:
The system performs automatic base distortion correction by utilizing the measurement data itself to generate correction information. The correction points and correction line are automatically determined by the system without requiring manual specification, making the system self-correcting and eliminating the need for operator skill in correction operations.
Solution Approach 2:
The invention changes the approach from manual parameter specification to automatic parameter determination. By introducing automatic generation of correction points and correction lines based on measurement data characteristics, the system transforms the correction process from a skill-dependent manual operation to an automated parameter-based process.
2Measurement precision
If a model or function is selected for curve fitting to correct base distortion, then correction can be performed, but it requires much skill in the selection of an appropriate model
Solution Approach 1:
The system automatically determines the correction line by processing the measurement data itself, eliminating the need for operators to select appropriate models or functions. The correction information is generated self-service style based on the actual measurement characteristics, making the process accessible without specialized knowledge.
Solution Approach 2:
The invention extracts correction information directly from the measurement data by identifying natural features (peaks, valleys, inflection points) and using them to define correction points and correction lines. This approach removes the need for external models or functions, taking out the complexity of model selection entirely.
3Productivity
If measurement is performed with fewer analysis points to reduce time, then measurement speed improves, but the influence of mechanical drift increases
Solution Approach 1:
The system converts the harmful effect of mechanical drift into useful correction information. By detecting the drift pattern through the measurement data itself and generating correction points and correction lines that account for the drift, the system transforms the drift from a source of error into a basis for correction, allowing fast measurement without sacrificing accuracy.
Solution Approach 2:
The invention implements a feedback mechanism where the measurement data is used to generate correction information that is then applied to correct the measurement results. The system continuously monitors the measurement data for drift patterns and automatically adjusts the baseline accordingly, creating a closed-loop correction system that maintains accuracy despite rapid scanning.
Data Source
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AI summary
A highly accurate three-dimensional measurement base is specified with simple settings. When a peak occurs in the positive Z-axis direction, a hemisphere or semi-spheroid figure (z ≥ 0) is placed to contain a position (xi, yi) where a base point should be obtained, scanning is performed such that the bottom of the figure contains the position (xi, yi), and the minimum value 1min of the difference between the Z position of a surface profile image and the height of the hemisphere or semi-spheroid figure at each position, and the height of the hemisphere or semi-spheroid figure at the position (xi, yi) are obtained. The maximum value of the sums is expressed as L(xi, yi), and a base point (Xi, Yi, L(xi,yi) is specified. Base points are specified throughout the target surface by the same base point setting method, and a three-dimensional measurement base is specified on the basis of the specified base points.