Semi-Transparent Display With Rear-Side SOI Contacts
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Solution Overview
Problem
Existing methods for producing semi-transparent displays using SOI wafers limit contact options to other components to the front side, restricting their applications.
Innovation Solution
The silicon substrate of the SOI wafer is removed, allowing for the formation of electrically conductive connections on the rear side and the use of a transparent cover layer to maintain mechanical stability, enabling semi-transparency and rear-side contact options.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the silicon substrate of the SOI wafer is removed, then semi-transparency and rear-side contact options are enabled, but mechanical stability deteriorates
Solution Approach 1:
The silicon substrate is removed from the SOI wafer structure to enable semi-transparency and rear-side contact options. This extraction of the opaque substrate layer allows light transmission through the display while exposing the rear side for wiring connections.
Solution Approach 2:
A transparent cover layer is introduced as an intermediary component to provide mechanical stability and protection after silicon substrate removal. This cover layer maintains the structural integrity of the display while allowing light transmission, replacing the mechanical support function of the removed substrate.
2Illumination intensity
If the silicon substrate is removed to achieve semi-transparency, then light transmission is improved, but structural support deteriorates
Solution Approach 1:
The opaque silicon substrate is extracted from the structure to enable light transmission through the display. This removal eliminates the barrier to light propagation, achieving the desired semi-transparent effect.
Solution Approach 2:
A transparent cover layer serves as an intermediary that provides structural support while maintaining light transmission. This layer replaces the mechanical support function of the removed substrate without blocking light, thus resolving the contradiction between transparency and structural integrity.
3Adaptability or versatility
If contact areas are exposed on the rear side, then wiring flexibility is improved, but manufacturing complexity increases
Solution Approach 1:
Contact areas are exposed on the rear side during the manufacturing process before final assembly. This preliminary exposure of contact areas simplifies subsequent wiring operations by providing ready-access connection points, reducing the overall manufacturing complexity despite the additional step.
Data Source
AI summary
Provided is a semi-transparent display and a method for producing a semi-transparent display. An SOI wafer is provided, the surface having at least one pixel region and at least one contact region arranged next to the pixel region, the SOI wafer comprising a silicon substrate on the rear side. At least one electromagnetic-radiation-emitting layer is deposited on the front side of the SOI wafer. At least one transparent cover layer is applied above the at least one electromagnetic-radiation-emitting layer. A wiring carrier is fastened to the assembly comprising the SOI wafer, the electromagnetic-radiation-emitting layer and the transparent cover layer. Before fastening of the wiring carrier to the assembly, the silicon substrate is removed from the assembly, producing a residual assembly, and electrically conductive connections are formed between the contact region of the SOI wafer and the wiring carrier from the rear side of the SOI wafer.