Semiconductive Resin Composition for Power Cable Peelability
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Solution Overview
Problem
Conventional semiconductive resin compositions for power transmission cables face issues with high viscosity and abnormal charring during extrusion, affecting the ease of peelability from insulating layers and extrudability.
Innovation Solution
A semiconductive resin composition comprising an ethylene-vinyl acetate copolymer with high vinyl acetate content, combined with fatty acid zinc, oleic acid bisamide, trimellitic acid ester, and a peroxide-based crosslinking agent, along with carbon having a specific DBP adsorption capacity, to enhance peelability and extrudability while preventing charring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a high polarity polymer such as ethylene vinyl acetate copolymer with high vinyl acetate content is used as the base polymer, then peelability from the electrically insulating layer is improved, but viscosity increases and extrudability deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the base polymer by specifying ethylene vinyl acetate copolymer with 60-80 mass% vinyl acetate content, and controls the proportions of various additives (fatty acid zinc: 1-5 parts, oleic acid bisamide: 1-5 parts, trimellitic acid ester: 1-5 parts per 100 parts polymer) to achieve optimal balance between peelability and extrudability
Solution Approach 2:
The patent creates a composite semiconductive resin composition by combining ethylene vinyl acetate copolymer with multiple additives including fatty acid zinc, oleic acid bisamide, trimellitic acid ester, peroxide-based crosslinking agent, and carbon black, where each component contributes specific properties to resolve the contradiction between peelability and extrudability
2Reliability
If conventional semiconductive resin composition is used, then adhesion to electrically insulating layer is achieved, but charring (carbonization) occurs during extrusion
Solution Approach 1:
The patent introduces peroxide-based crosslinking agent (dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, or 2,5-dimethyl-2,5-di(pentachlorophenylperoxy)hexane) as an intermediary substance that facilitates controlled crosslinking during extrusion, preventing uncontrolled charring while maintaining adhesion properties
Solution Approach 2:
The patent specifies precise temperature control parameters (extrusion temperature: 80-95°C, vulcanization temperature: 150-180°C) and crosslinking agent dosage (0.5-3 parts per 100 parts total polymer and additive) to prevent charring while achieving proper adhesion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves good easy peelability from insulating layers and improved extrudability, maintaining electrical and mechanical properties, and preventing charring during the extrusion process.
Implementation Method 1
a peroxide-based crosslinking agent having a one hour half-life temperature of not lower than 130 degrees C.
Implementation Method 2
a carbon having a DBP (dibutyl phthalate) adsorption capacity of not larger than 150 mg/g
Data Source
AI summary
A semiconductive resin composition is composed of a base polymer including an ethylene-vinyl acetate copolymer with a vinyl acetate content of not lower than 60 percent by weight, two or more of fatty acid zinc, oleic acid bisamide and trimellitic acid ester, a peroxide-based crosslinking agent having a one hour half-life temperature of not lower than 130 degrees C., and a carbon having a DBP (dibutyl phthalate) adsorption capacity of not larger than 150 mg/g.