Semiconductor Absorption-Edge Thermometry for Non-Contact Surface Monitoring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional temperature measurement techniques require physical contact, are limited in temperature range or sensitivity, or necessitate complex and expensive instrumentation, making them impractical for non-contact, sensitive, and cost-effective temperature monitoring.
Innovation Solution
A non-contact temperature monitoring system using temperature-dependent semiconductor materials that utilize the absorption edge wavelength shift with temperature, employing monochromatic light and a detector to measure reflected light changes, allowing for temperature determination without physical contact and using inexpensive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional temperature measurement techniques (thermocouples, black body radiation, fluorescence) are used, then temperature can be measured, but physical contact is required or complex instrumentation is needed
Solution Approach 1:
The patent replaces physical contact-based temperature measurement (mechanical/thermal systems) with optical measurement systems. Specifically, it uses a camera to detect reflected light from a semiconductor material, substituting the mechanical contact of thermocouples with non-contact optical detection. This resolves the contradiction by enabling non-contact measurement while using relatively simple, readily available camera equipment rather than complex specialized instrumentation.
Solution Approach 2:
The patent introduces a semiconductor material as an intermediary between the light source and the camera detector. This intermediary material provides a temperature-dependent optical response (absorption edge) that enables non-contact temperature measurement. The semiconductor acts as a mediator that converts temperature information into optical signal variations that the camera can detect, resolving the contradiction between non-contact capability and measurement reliability.
2Measurement precision
If band edge thermometry with spectrometer is used, then temperature measurement is achieved, but expensive spectrometer equipment is required
Solution Approach 1:
The patent replaces expensive, complex spectrometer equipment with inexpensive, readily available digital cameras. Instead of using sophisticated spectral analysis instruments, the invention uses consumer-grade or industrial cameras that are widely available and cost-effective. This substitution maintains sufficient measurement precision for practical applications while dramatically reducing equipment cost and complexity.
Solution Approach 2:
The patent substitutes complex optical spectrometry systems with simpler camera-based detection. Rather than using diffraction gratings, prisms, and spectral scanning mechanisms found in spectrometers, the invention uses a camera sensor to detect intensity variations of reflected light at specific wavelengths. This mechanical/optical system substitution achieves acceptable temperature measurement precision while eliminating expensive specialized equipment.
3Measurement precision
If optical fiber bonded semiconductor is used for band edge thermometry, then temperature measurement is possible, but physical contact with the measured object is required
Solution Approach 1:
The patent replaces the physical contact arrangement (optical fiber bonded to semiconductor on object surface) with a non-contact optical measurement system. The camera detects light reflected from the semiconductor material without requiring physical contact between the measurement system and the object being measured. This substitution maintains temperature measurement capability while eliminating the physical contact requirement, enabling measurement of moving or inaccessible objects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides rapid, high-resolution temperature monitoring capable of measuring through glass or water, immune to electromagnetic noise, and suitable for moving objects, with the ability to determine mechanical information like rotational speed and eccentricity.
Implementation Method 1
The semiconductor member has a temperature-dependent bandgap with an absorption edge that varies with temperature. A light source is configured to illuminate the semiconductor member with monochromatic light. The monochromatic light has a wavelength equal to an absorption edge wavelength that is associated with the absorption edge when the semiconductor member is at a specified temperature.
Implementation Method 2
The energy of the transition from absorbing to transmitting defines the optical absorption edge of the sample and is temperature dependent. This technique uses the temperature dependence of a semiconductor's band gap to measure temperatures.
Data Source
AI summary
A temperature monitoring system includes a semiconductor member mounted onto the surface of an object having a surface whose temperature is to be monitored. The semiconductor member has a temperature-dependent bandgap with an absorption edge that varies with temperature. A light source is configured to illuminate the semiconductor member with monochromatic light. The monochromatic light has a wavelength equal to an absorption edge wavelength that is associated with the absorption edge when the semiconductor member is at a specified temperature. An imaging device is configured to receive light reflected from the semiconductor member when illuminated with the monochromatic light such that a surface temperature of the object is at the specified temperature when a change in an amount of reflected light that is received indicates that the wavelength of the monochromatic light is equal to the absorption edge wavelength at the specified temperature.