Semiconductor High Voltage Testing via ADC Conversion
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Solution Overview
Problem
Existing semiconductor devices face difficulties in testing high voltage after packaging, as the mini-pad and measurement pad within the chip cannot be electrically connected to external pins, leading to measurement errors and the need to re-open the package for testing, which introduces noise and inefficiency.
Innovation Solution
Incorporating an Analog to Digital Converter (ADC) in the circuit to measure high voltage after packaging, allowing for the conversion of high voltage signals into digital signals for comparison, enabling stable high voltage testing without disassembling the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If measurement and trimming are performed on wafer before packaging, then high voltage can be measured initially, but after packaging the mini-pad and measurement pad cannot be electrically connected to external pins making measurement difficult
Solution Approach 1:
The patent extracts the measurement function from the traditional external pad-based system and integrates it into the chip interior through the ADC converter. The ADC converts high voltage signals into digital signals that can be read through standard I/O pins, effectively taking out the measurement capability from the packaging barrier and making it accessible after packaging.
Solution Approach 2:
The ADC converter acts as an intermediary between the high voltage generator and the external measurement system. It translates the high voltage analog signal into a digital signal that can be easily read through standard I/O pins, serving as a mediator that bridges the gap between the internal high voltage circuit and external measurement equipment without requiring direct electrical connection to the mini-pad.
2Reliability
If packaging is completed, then device integrity is maintained, but high voltage testing becomes difficult requiring package removal and re-testing
Solution Approach 1:
The patent implements preliminary action by integrating the ADC converter and high voltage measurement circuitry into the chip before packaging. This allows all necessary measurement and trimming operations to be performed while the chip is still accessible, eliminating the need to remove packaging for testing and thereby maintaining device integrity while improving testing efficiency.
Solution Approach 2:
The device performs self-service by incorporating self-diagnostic and self-measurement capabilities through the integrated ADC converter. The high voltage generator and measurement circuits are designed to work together as a self-contained system that can test itself without external intervention or package removal, improving productivity while maintaining reliability.
3Measurement precision
If measurement pad is used for high voltage testing, then initial value can be read, but numerous measurement errors occur due to noise introduction between oscilloscope and probe
Solution Approach 1:
The patent replaces the mechanical/probe-based measurement system with an electronic digital conversion system. Instead of using an oscilloscope and probe to directly read high voltage (which introduces noise), the ADC converter digitally captures and processes the voltage signal, eliminating the physical connection path where noise could be introduced and thereby improving measurement precision.
Solution Approach 2:
The ADC converter creates a digital copy of the high voltage signal for measurement purposes. Rather than directly monitoring the high voltage through prone-to-noise analog connections, the system converts the voltage into a digital code that can be read without continuous electrical contact, effectively copying the measurement information while eliminating noise introduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable and efficient high voltage testing post-packaging by converting high voltage signals into digital codes, reducing measurement errors and eliminating the need to re-open the package, thus shortening test time and maintaining device integrity.
Implementation Method 1
Incorporating an Analog to Digital Converter (ADC) in the circuit to measure high voltage after packaging, allowing for the conversion of high voltage signals into digital signals for comparison
Data Source
AI summary
A semiconductor memory device includes a high voltage generator for generating a high voltage and applying the generated high voltage to a memory unit, a converter for converting an output voltage of the high voltage generator into a digital signal, and a mode selection unit for outputting an output of the converter or an output of the memory unit through an I/O terminal selectively.