Semiconductor Connection Structure Adhesion Area

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Solution Overview

Problem

Existing semiconductor device connection structures face challenges in securely attaching flexible boards to semiconductor elements and ultrasonic transducers without compromising the performance of the semiconductor devices, particularly in ultrasonic endoscope systems, due to issues with adhesive infiltration and mechanical deformation.

Innovation Solution

A semiconductor device connection structure is developed, featuring a support member with a columnar shape stacked on the semiconductor element or ultrasonic transducers, where the flexible board is adhered only to the side surface of the support member with an adhesive, increasing the adhesion area and preventing adhesive infiltration into the semiconductor device, while maintaining the mechanical integrity of the transducers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the flexible board is adhered directly to the semiconductor element, then the connection is simple, but the adhesive may infiltrate into the semiconductor device and compromise its performance

Engineering Contradiction:

Improveconnection structureVSAvoidsemiconductor device performance

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The support member divides the adhesion function from the semiconductor element, creating a separate adhesion zone. The flexible board adheres to the support member rather than directly to the semiconductor element, segmenting the potential adhesive infiltration path and protecting the semiconductor device while maintaining connection simplicity.

Inventive Principle:

Principle #1Segmentation

2Strength

If the adhesive is applied to increase adhesion area, then the fixation strength improves, but the adhesive may infiltrate into the semiconductor device

Engineering Contradiction:

Improveadhesion strengthVSAvoidadhesive infiltration

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The support member acts as an intermediary between the flexible board and the semiconductor element. It provides a dedicated adhesion surface that increases the bonding area and fixation strength while preventing adhesive from reaching and infiltrating into the semiconductor device, thus eliminating the harmful effect.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If a support member is added to prevent adhesive infiltration, then the semiconductor device performance is protected, but the device complexity increases

Engineering Contradiction:

Improvesemiconductor device performanceVSAvoidconnection structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The support member serves multiple functions simultaneously: it provides a large adhesion area for the flexible board, prevents adhesive infiltration into the semiconductor device, and maintains mechanical integrity. This multi-functionality justifies the added component by consolidating several protective and functional roles into a single element.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Object-affected harmful factors

If the flexible board is adhered to the side surface only, then adhesive infiltration is prevented, but the alignment and connection difficulty increases

Engineering Contradiction:

Improveadhesive infiltrationVSAvoidalignment and connection

Core Design Contradiction:

Object-affected harmful factorsVSEase of operation

Solution Approach 1:

The support member is pre-positioned on the semiconductor element with its adhesion surface exposed on the side. This preliminary arrangement creates a ready-made, accessible bonding surface that guides the flexible board placement, making alignment easier and preventing adhesive infiltration from the outset rather than requiring complex alignment procedures.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the fixation strength of the flexible board connection without compromising the performance of the semiconductor devices, allowing for improved reliability in ultrasonic endoscope systems by preventing adhesive infiltration and allowing for easier alignment and connection.

Implementation Method 1

The flexible board is arranged on a side surface of the semiconductor element and on a side surface of the support member and is adhered only to the side surface of the support member with an adhesive

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS9997449B2Semiconductor device connection structure, ultrasonic module, and ultrasonic endoscope system having ultrasonic module

Publication Date: 2018.06.12 OLYMPUS CORPORATION(JP)

AI summary

A semiconductor device connection structure includes: a semiconductor element having a plate shape and including an external connection electrode on a surface of the semiconductor element; a support member which is stacked on the semiconductor element to be adhered to the semiconductor element and of which adhesion surface has a column shape that is substantially same as that of the semiconductor element, a thickness of the support member in a stacking direction being larger than that of the semiconductor element; and a flexible board configured to be electrically connected to the external connection electrode. The flexible board is arranged on a side surface of the semiconductor element and on a side surface of the support member and is adhered only to the side surface of the support member with an adhesive.