Semiconductor Package Adhesive Stability Under Thermal Stress
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Solution Overview
Problem
As semiconductor package structures are scaled down, the thinning of substrates leads to adhesive material collapse during high-temperature bonding, resulting in yield and reliability issues due to coupling loss between components.
Innovation Solution
A semiconductor package structure is manufactured using a photonic component with a substrate and a light emitter, where the adhesive material is heated to a temperature below its glass transition temperature to prevent collapse, and a two-step heat process is employed to minimize alignment offset and coupling loss, ensuring the adhesive material remains stable and effective.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the substrate is thinned to scale down the semiconductor package structure, then the package size is reduced, but the adhesive material collapses during high-temperature bonding
Solution Approach 1:
The patent changes the temperature parameter during bonding to be below the glass transition temperature of the adhesive material, preventing the adhesive from softening and collapsing while still enabling successful bonding of components to the thinned substrate
Solution Approach 2:
The patent performs preliminary alignment and positioning of components on the thinned substrate before applying heat for bonding, ensuring that the adhesive material is properly positioned and will not collapse during the bonding process
2Strength
If high-temperature bonding is applied to bond components to the substrate, then bonding strength is improved, but the adhesive material collapses
Solution Approach 1:
The patent modifies the temperature parameter from conventional high-temperature bonding to a lower temperature regime (below the glass transition temperature of the adhesive), which maintains bonding strength while preventing the adhesive material from softening and deforming
3Ease of manufacture
If the adhesive material is heated above its glass transition temperature, then bonding is facilitated, but alignment offset increases causing coupling loss
Solution Approach 1:
The patent changes the heating temperature parameter to remain below the glass transition temperature of the adhesive material, which maintains adequate bonding capability while preventing thermal deformation and alignment offset that would cause coupling loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces coupling loss to less than 3 dB, enhancing the yield and reliability of semiconductor packages by maintaining adhesive integrity and minimizing thermal deformation-induced misalignment.
Implementation Method 1
a highest temperature of the adhesive material in the first heat operation is less than a glass transition temperature of the adhesive material
Implementation Method 2
The light emitter is configured to emit light through the first port
Data Source
AI summary
A semiconductor package structure and a method of manufacturing the same are provided. A semiconductor package structure includes a first electronic component and a light emitter. The photonic component includes a substrate and a first port. The light emitter is disposed over the substrate of the photonic component. The light emitter is configured to emit light through the first port. A coupling loss between the first port of the photonic component and the light emitter is less than 3 dB.