Semiconductor Package Adhesive Layout for Die Heat Dissipation
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Solution Overview
Problem
Heat dissipation in semiconductor packages is inefficient due to the use of molding compounds with poor thermal conductivity, which limits the application of these packages and can lead to copper contamination and copper-in-fin issues.
Innovation Solution
A semiconductor package design where an adhesive layer with low thermal conductivity covers only the peripheral region of the semiconductor die, exposing the central region for contact with a thermal conductive layer, allowing for effective heat dissipation without the need to remove the adhesive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a molding compound is used to package semiconductor dies, then the dies are protected and bonded to other package components, but heat dissipation becomes inefficient due to poor thermal conductivity of the molding compound
Solution Approach 1:
The adhesive layer is segmented into two distinct regions: a peripheral region that provides protection and bonding, and a central region that exposes the die for thermal contact. This segmentation allows each region to fulfill its specific function without compromising the other.
Solution Approach 2:
Different regions of the adhesive layer are assigned different thermal conductivities: the peripheral region has low thermal conductivity for protection, while the central region has high thermal conductivity for heat dissipation. This local differentiation resolves the contradiction between protection and thermal management.
2Reliability
If an adhesive layer covers the entire backside surface of the semiconductor die, then protection and bonding are improved, but heat dissipation is hindered and copper contamination risks increase
Solution Approach 1:
The adhesive layer is divided into a peripheral region for protection and a central region for thermal management, preventing copper contamination by exposing only the necessary central area while maintaining protective coverage at the edges.
Solution Approach 2:
The adhesive layer exhibits spatially varying thermal conductivity properties, with the peripheral region providing protective coverage and the central region enabling thermal contact, thus preventing copper contamination while maintaining protection where needed.
3Temperature
If the adhesive layer is removed to improve heat dissipation, then thermal contact is improved, but manufacturing complexity and process difficulty increase
Solution Approach 1:
The adhesive layer is pre-configured during manufacturing with differentiated thermal conductivity regions, eliminating the need for subsequent removal or modification steps. The thermal management functionality is built-in from the outset, reducing manufacturing complexity.
Solution Approach 2:
The adhesive layer itself provides the thermal management function through its differentiated structure, eliminating the need for separate heat dissipation components or processes. The adhesive serves dual purposes: protection and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation performance, prevents copper contamination, and expands the process window for cleaning the semiconductor die, thereby improving the application and reliability of semiconductor packages.
Implementation Method 1
exposing the central region for contact with a thermal conductive layer, allowing for effective heat dissipation
Data Source
AI summary
A semiconductor package includes a first semiconductor die, an adhesive layer, a second semiconductor die, a plurality of conductive pillars and an encapsulant. The adhesive layer is adhered to the first semiconductor die. The second semiconductor die is stacked over the first semiconductor die. The conductive pillars surround the first semiconductor die. The encapsulant encapsulates the first semiconductor die and the conductive pillars, wherein a top surface of the encapsulant is higher than top surfaces of the conductive pillars.