Semiconductor Base Plate Adhesive Dip and Inclined Surface
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Solution Overview
Problem
Existing semiconductor device manufacturing techniques fail to regulate the direction of adhesive agent widening during bonding, leading to unintended spreading and potential spills due to viscosity changes with temperature.
Innovation Solution
A semiconductor device design featuring a base plate with a dip and inclined surface at its peripheral edge, where the adhesive agent is applied, allowing controlled widening along the inclined surface as viscosity decreases with temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive agent is applied to the whole bonding surface, then bonding coverage is improved, but adhesive agent spreads uncontrollably when temperature increases and viscosity decreases
Solution Approach 1:
The bonding surface is divided into different regions with different functions: a dip region for adhesive application and an inclined surface region for controlled spreading. This local differentiation allows the adhesive to be confined to specific areas while enabling controlled widening in desired directions only.
Solution Approach 2:
The dip and inclined surface structures are pre-formed on the bonding surface before adhesive application. This preliminary preparation creates built-in guides that control adhesive flow direction from the outset, preventing uncontrolled spreading while maintaining adequate bonding coverage.
2Ease of operation
If adhesive agent viscosity decreases with temperature increase, then adhesive flowability is improved, but direction control of adhesive widening is lost
Solution Approach 1:
The solution introduces a dimensional aspect by creating an inclined surface that slopes in a specific direction. This geometric dimension guides the adhesive flow along the slope, ensuring that even when viscosity decreases and flowability increases, the adhesive widens only in the direction of the incline rather than spreading randomly in all directions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Regulates the direction of adhesive agent widening, preventing spills and ensuring proper adhesion while reducing processing costs through controlled application and widening along specific surfaces.
Implementation Method 1
If a temperature of the adhesive agent is increased in hardening a sealing resin and viscosity of the adhesive agent decreases, the adhesive agent is wetly widened along the inclined surface from the dip
Data Source
AI summary
An object is to provide a technique capable of regulating a direction in which an adhesive agent used for bonding a base plate and a case is wetly widened. A semiconductor device includes a base plate and a case. The case is bonded to a peripheral edge part of the base plate via an adhesive agent. A dip which is an application position where the adhesive agent is applied and an inclined surface directed downward from the dip toward an outer peripheral side or an inclined surface directed downward from the dip toward an inner peripheral side are formed in the peripheral edge part of the base plate.