Semiconductor Adhesive Composition with Dual Silane Coupling Agents
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Solution Overview
Problem
Existing adhesive compositions for semiconductor die bonding fail to maintain adhesiveness and package reliability under high temperature and humidity conditions, particularly during the reflow process, due to the limitations of silane coupling agents in terms of reactivity and storage stability.
Innovation Solution
A semiconductor adhesive composition combining an acrylic polymer, an epoxy-based heat curable resin, a high molecular weight silane compound with an epoxy group, and a low molecular weight silane compound with an epoxy group, which together provide enhanced adhesiveness and storage stability, ensuring strong bonding even after exposure to harsh conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If silane coupling agent of monomer type with small molecular weight is used, then adhesiveness is improved, but storage stability deteriorates due to low activity and insufficient reactivity
Solution Approach 1:
The patent uses a composite adhesive system combining epoxy-based heat curable resin with dual silane coupling agents (monomer type and oligomer type) to achieve both high adhesiveness and storage stability. The oligomer type silane coupling agent provides storage stability while the monomer type provides adhesiveness, creating a synergistic composite material system that resolves the contradiction between these two properties.
Solution Approach 2:
The patent changes the molecular weight parameter of the silane coupling agent by using both monomer type (small molecular weight) and oligomer type (larger molecular weight) in combination. This parameter change allows the system to achieve both high reactivity (from monomer) and storage stability (from oligomer), resolving the contradiction between adhesiveness and storage stability.
2Reliability
If silane coupling agent of oligomer type with high reactivity is used, then storage stability is improved, but adhesiveness deteriorates due to premature reaction during storage
Solution Approach 1:
The patent creates a composite adhesive system where oligomer type silane coupling agent provides storage stability while monomer type silane coupling agent maintains adhesiveness. The combination compensates for the loss of adhesiveness in oligomer-type agents by incorporating monomer-type agents that retain high reactivity and bonding capability.
Solution Approach 2:
The epoxy-based heat curable resin acts as an intermediary that facilitates the bonding between the silane coupling agents and the substrate. It mediates the reaction process, allowing the oligomer type silane coupling agent to provide storage stability while the monomer type maintains adhesiveness through the epoxy resin's curing mechanism.
3Ease of manufacture
If adhesive sheet is stored for certain period before use, then production flexibility is improved, but adhesiveness deteriorates due to reaction between alcoxy groups during storage
Solution Approach 1:
The patent uses a composite system with both monomer and oligomer type silane coupling agents where the monomer type compensates for the loss of reactive alcoxy groups during storage. This composite approach allows the adhesive sheet to be stored for extended periods while maintaining sufficient adhesiveness for semiconductor die bonding applications.
Solution Approach 2:
The patent incorporates excess monomer type silane coupling agent in the adhesive composition as a cushion against the loss of reactive groups during storage. This beforehand cushioning ensures that even after prolonged storage and partial reaction of alcoxy groups, sufficient reactive groups remain to provide adequate adhesiveness when the adhesive is applied.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition maintains high shear strength and package reliability even after accelerated testing and exposure to high temperature and humidity, effectively addressing the limitations of previous adhesive technologies.
Implementation Method 1
the reaction between the alcoxy groups against each other
Implementation Method 2
the alcoxy group and the inorganic filler material surface may proceed
Implementation Method 3
an epoxy-based heat curable resin (B), a heat curing agent (C)
Data Source
AI summary
An adhesive composition for a semiconductor includes an acrylic polymer (A), an epoxy-based heat curable resin (B), a heat curing agent (C), a silane compound (D) having an organic functional group, molecular weight of 300 or more and an alkoxy equivalent of larger than 13 mmol/g, and a silane compound (E) having an organic functional group, molecular weight of 300 or less and an alkoxy equivalent of 13 mmol/g or less.