Semiconductor Adhesive Film for Fast Cure and Room-Temperature Stability

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Solution Overview

Problem

The challenge in semiconductor packaging is to develop an adhesive composition that can be rapidly cured at high temperatures during thermo-compression bonding while maintaining excellent storage stability at room temperature, as existing adhesives face issues with curing speed and storage stability.

Innovation Solution

An adhesive resin composition comprising a thermoplastic resin, a thermosetting resin, a curing agent, and a compound represented by Chemical Formula 1, which includes an organic functional group capable of hydrogen bonding, allowing for controlled curing at high temperatures and delayed curing at room temperature, ensuring rapid curing and long-term storage stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a thermosetting adhesive is used for bump bonding, then the adhesive can be cured at high temperature, but the curing speed is slow and storage stability deteriorates

Engineering Contradiction:

Improvecuring temperatureVSAvoidcuring speed

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The patent changes the chemical parameters of the adhesive composition by incorporating specific catalysts (imidazole compounds) and controlling the ratio of thermoplastic to thermosetting resins. This enables the adhesive to cure rapidly at high temperatures (above 100°C) while remaining stable at room temperature, resolving the contradiction between curing temperature and curing speed.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite adhesive system combining thermoplastic resin, thermosetting resin, and catalyst in specific proportions. This composite structure allows the adhesive to exhibit both rapid high-temperature curing capability and excellent storage stability, overcoming the limitations of single-component adhesives.

Inventive Principle:

Principle #40Composite materials

2Temperature

If a thermosetting adhesive is used for bump bonding, then the adhesive can be cured at high temperature, but storage stability worsens

Engineering Contradiction:

Improvecuring temperatureVSAvoidstorage stability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent optimizes the chemical composition parameters by controlling the weight ratio of thermoplastic to thermosetting resin (1:9 to 4:6) and adding specific catalysts. This parameter optimization enables the adhesive to maintain stability at room temperature during storage while achieving complete curing at high temperatures, resolving the contradiction between curing temperature and storage stability.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces catalysts (imidazole compounds) as intermediaries that mediate the curing reaction. These catalysts remain inactive at room temperature, preserving storage stability, but become active at high temperatures to enable rapid curing, thus resolving the contradiction between storage stability and high-temperature curability.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If a catalyst is added to control curing degree, then curing can be controlled at high temperature, but storage stability deteriorates

Engineering Contradiction:

Improvecuring controlVSAvoidstorage stability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent selects catalysts with specific activation characteristics (imidazole compounds) and controls their concentration within optimal ranges. These catalysts exhibit temperature-dependent activity, remaining inactive at room temperature to preserve storage stability while becoming highly active at high temperatures to enable controlled rapid curing, resolving the contradiction between curing control and storage stability.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adhesive composition enables rapid curing at high temperatures during thermo-compression bonding and maintains excellent storage stability at room temperature, improving the reliability and efficiency of semiconductor packaging processes.

Implementation Method 1

a compound having a functional group capable of hydrogen bonding, wherein the functional group capable of hydrogen bonding delays a curing reaction at a room temperature but promotes the curing reaction at a high temperature

Methodology Applied

Scientific EffectHydrogen bonding:

Implementation Method 2

the functional group capable of hydrogen bonding delays a curing reaction at a room temperature but promotes the curing reaction at a high temperature

Methodology Applied

Scientific EffectThermal activation:

Data Source

PatentUS11834415B2Adhesive composition for semiconductor circuit connection and adhesive film including the same

Publication Date: 2023.12.05 LG CHEM LTD

AI summary

The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.