Dual-Layer Adhesive Film for Semiconductor Fillet Control
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Solution Overview
Problem
The existing semiconductor packaging process faces challenges in effectively controlling the fillet generated during thermal compression bonding, which can lead to issues like fillet flow and solder fusion to the chip, especially in high-density and high-integration packages.
Innovation Solution
A film for bonding semiconductors is developed, comprising a first adhesive layer with a thermosetting resin, thermoplastic resin, and thermal curing agent, and a second adhesive layer with a thermosetting resin, thermoplastic resin, thermal curing agent, photopolymerizable monomer, and photoinitiator. This dual-layer structure allows for excellent adhesive strength and controlled fillet management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a non-conductive film (NCF) is used as adhesive in thermal compression bonding, then embedding and process time are improved, but fillet control deteriorates causing flow problems
Solution Approach 1:
The adhesive film is segmented into multiple layers with different functional properties. The first adhesive layer provides strong bonding, while the second adhesive layer with photopolymerizable monomer enables precise fillet control through UV curing, resolving the contradiction between process efficiency and fillet precision.
Solution Approach 2:
The adhesive composition parameters are changed by incorporating photopolymerizable monomers and photoinitiators in the second adhesive layer. This allows the fillet to be cured on-demand using UV light, transforming the fillet from a problematic byproduct into a controllable bonding element.
2Reliability
If excessive fillet is discharged during compression, then adhesive coverage is improved, but solder fusion to chip occurs
Solution Approach 1:
The adhesive layers are prepared in advance with specific compositions before the bonding process. The first layer ensures complete coverage and strong adhesion, while the second layer is designed to control fillet discharge and prevent solder fusion through photopolymerization.
Solution Approach 2:
The second adhesive layer acts as an intermediary between the first adhesive layer and the external environment. It mediates the fillet discharge process by providing a photopolymerizable composition that can be selectively cured to contain the fillet and prevent harmful solder fusion.
3Manufacturing precision
If dual-layer adhesive structure is implemented, then fillet control and adhesive strength are improved, but device complexity increases
Solution Approach 1:
Multiple functions are merged into a single integrated adhesive film structure. The first adhesive layer provides bonding strength, while the second layer provides fillet control and UV curability, combining these functions in one component rather than requiring separate systems.
Solution Approach 2:
The adhesive film achieves multi-functionality by incorporating different resin systems in each layer. The first layer ensures strong adhesion, while the second layer provides UV-responsive fillet control, making the single film structure capable of performing multiple critical functions simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The film effectively controls the fillet generated in the semiconductor packaging process while maintaining excellent adhesive force, thereby preventing solder fusion to the chip and improving the quality reliability of semiconductor packages.
Implementation Method 1
a photopolymerizable monomer containing one or more photocurable functional groups, and a photoinitiator
Implementation Method 2
a first adhesive layer containing a first adhesive composition comprising a first thermosetting resin, a first thermoplastic resin, and a first thermal curing agent
Data Source
AI summary
A film for bonding semiconductors, which easily controls the fillet while exhibiting excellent adhesion force, and can prevent a problem in which solder is melted and fused to a chip; and a semiconductor package using the same.