Semiconductor Mounting Adhesive Gap Control
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Solution Overview
Problem
The existing adhesives for semiconductor mounting, particularly those containing silicone resin, often fail to provide sufficient gap control and heat resistance, as they are too soft and have low thermal stability.
Innovation Solution
An adhesive comprising a silicone resin and a spacer with specific properties, including a spacer content of 0.1% to 5% by weight, a 10% compressive elasticity modulus between 5000 N/mm² and 15000 N/mm², and an average particle diameter of 10 µm to 200 µm, which maintains high precision gap control and increased heat resistance when subjected to high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a silicone-based resin adhesive is used for bonding semiconductor chips, then heat resistance is improved, but gap control precision deteriorates because the adhesive is too soft
Solution Approach 1:
The patent combines silicone resin with thermally expanded particles to create a composite adhesive material. The silicone resin provides heat resistance while the thermally expanded particles provide rigidity and gap control, resolving the contradiction between softness and precision.
Solution Approach 2:
The patent changes the physical parameters of the adhesive by incorporating particles with specific compressive elasticity moduli (500-5000 N/mm²) and controlled expansion rates (100-500%). This allows the adhesive to maintain shape precision during curing while achieving the required heat resistance.
2Manufacturing precision
If the spacer content is increased to improve gap control, then gap control precision is improved, but adhesion strength deteriorates
Solution Approach 1:
The patent optimizes the spacer content parameter to within 10% by weight, and carefully selects particles with compressive elasticity moduli between 500-5000 N/mm². This parameter optimization ensures sufficient gap control without compromising adhesion strength, as excessive spacer content would reduce the continuous adhesive phase.
Solution Approach 2:
The patent creates local rigidity through dispersed thermally expanded particles within the adhesive matrix, rather than using a fully rigid structure. This allows different regions of the adhesive to have different properties: rigid enough for gap control locally, but maintaining overall adhesion through the continuous silicone resin phase.
3Manufacturing precision
If a rigid spacer material is used to improve gap control, then gap control precision is improved, but heat resistance deteriorates
Solution Approach 1:
The patent creates a composite where thermally expanded particles (providing rigidity for gap control) are dispersed in a silicone resin matrix (providing heat resistance). The silicone resin ensures the adhesive can withstand high temperatures while the particles maintain dimensional stability during curing.
Solution Approach 2:
The silicone resin acts as an intermediary material that transfers and distributes thermal stress around the rigid thermally expanded particles. This prevents stress concentration that would occur with purely rigid spacers, maintaining both gap control and heat resistance.
4Manufacturing precision
If the compressive elasticity modulus of the spacer is increased to improve rigidity, then gap control precision is improved, but adhesion strength deteriorates
Solution Approach 1:
The patent specifies a compressive elasticity modulus range of 500-5000 N/mm² for the thermally expanded particles. This optimized range provides sufficient rigidity for gap control (higher than conventional spacers) while the limited 10% weight content ensures adhesion strength is maintained through the continuous adhesive phase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive achieves high-precision gap control and enhanced heat resistance, ensuring strong adhesion of semiconductor chips even at high temperatures, thereby improving the reliability of semiconductor sensors.
Implementation Method 1
a thermally expanded particle which has a compressive elasticity modulus of 500 N/mm2 or more and an expansion rate of 100% or more
Implementation Method 2
the 10% compressive elasticity modulus of the spacer being 5000 N/mm2 or more
Implementation Method 3
an adhesive used for mounting a semiconductor and containing a silicone resin and a spacer
Data Source
Figure 1
AI summary
Provided is an adhesive for semiconductor mounting that can achieve high-precision gap control and can increase heat resistance when a semiconductor is mounted. An adhesive for semiconductor mounting according to the present invention is an adhesive that is used for mounting a semiconductor, and contains a silicone resin and a spacer, the content of the spacer being 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive, the 10% compressive elasticity modulus of the spacer being 5000 N/mm2 or more and 15000 N/mm2 or less, and the average particle diameter of the spacer being 10 µm or more and 200 µm or less.