Semiconductor Adhesive Film Composition for HAST Resistance and Bonding
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Solution Overview
Problem
Existing adhesive films for semiconductors face a challenge in balancing high accelerated temperature and humidity stress test (HAST) resistance with maintaining adequate adhesive force.
Innovation Solution
Incorporating an acrylic resin with a structural unit derived from a monomer having an aromatic ring, along with a thermosetting component and inorganic filler, to enhance both HAST resistance and adhesive force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an acrylic resin with low acrylonitrile content is used to improve HAST resistance, then HAST resistance is improved, but adhesive force decreases
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive film by incorporating specific structural units (acrylonitrile at 1-15 mass%, styrene at 5-50 mass%, and butyl acrylate at 30-80 mass%) to simultaneously achieve good HAST resistance and adhesive force. This parameter optimization resolves the contradiction by finding the optimal balance point where both properties are satisfied.
Solution Approach 2:
The patent creates a composite adhesive material combining multiple polymer components with complementary properties. The mixture of acrylonitrile-containing units (for HAST resistance), styrene units (for adhesive force), and butyl acrylate units (for flexibility and embeddability) forms a composite system that achieves both high HAST resistance and high adhesive force, overcoming the limitation of single-component systems.
2Productivity
If the line/space gap of wiring is narrowed for high integration, then integration level is improved, but HAST resistance requirement becomes more stringent
Solution Approach 1:
The patent adjusts the chemical composition parameters of the adhesive film, specifically controlling the content of acrylonitrile (1-15 mass%), styrene (5-50 mass%), and butyl acrylate (30-80 mass%) structural units. These parameter changes enable the adhesive to provide sufficient protection for narrow wiring gaps while maintaining high HAST resistance.
Solution Approach 2:
The adhesive film acts as an intermediary protective layer between the narrowed wiring structures and the harsh HAST environment. By incorporating specific polymer components with appropriate HAST resistance properties, the adhesive mediates the stress and environmental exposure, protecting the fine wiring while allowing high integration.
3Stability of the object's composition
If a thicker adhesive film is used to improve embeddability, then embeddability is improved, but adhesive force may decrease
Solution Approach 1:
The patent optimizes the thickness parameter of the adhesive film to 25-150 μm and combines it with specific compositional parameters (acrylonitrile 1-15 mass%, styrene 5-50 mass%, butyl acrylate 30-80 mass%). This multi-parameter optimization ensures that even at greater thicknesses for improved embeddability, the adhesive force remains high due to the synergistic composition.
Solution Approach 2:
The patent uses a composite adhesive formulation where butyl acrylate units (30-80 mass%) provide flexibility and embeddability, while styrene units (5-50 mass%) contribute to adhesive force. This composite structure allows the adhesive to maintain both high embeddability (through flexibility and thickness) and high adhesive force (through the sticky styrene component), resolving the contradiction between thickness and adhesion.
Data Source
AI summary
An adhesive film for a semiconductor contains a thermosetting component, an elastomer, and an inorganic filler. The elastomer contains an acrylic resin having a structural unit derived from a monomer having an aromatic ring. An integrated dicing/die bonding film includes a dicing film and the adhesive film for a semiconductor provided on the dicing film.