Semiconductor Module Adhesive for Moisture-Resistant Bonding

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Solution Overview

Problem

Semiconductor modules face detachment issues due to moisture absorption by adhesives, leading to potential damage to semiconductor chips, especially when adhesives with high water absorption rates are used to bond housings to bases or other components.

Innovation Solution

The semiconductor module incorporates an adhesive with a water absorption rate of 0.5% or less, specifically designed to minimize moisture absorption and subsequent detachment, using resin materials with fillers such as silicon oxide or aluminum oxide to reduce water absorption rates, and employing a manufacturing process that includes a defoaming step to ensure efficient adhesive application and curing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If an adhesive with high water absorption rate is used to bond the housing to the base, then the adhesive provides good initial bonding strength, but the adhesive absorbs moisture over time causing detachment of the housing from the base

Engineering Contradiction:

Improvebonding strengthVSAvoidbonding reliability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent changes the key parameter of water absorption rate from high to low (0.5% or less), selecting adhesive materials specifically for their low moisture absorption characteristics to prevent detachment while maintaining bonding strength

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs composite adhesive materials composed of multiple resin components (e.g., epoxy resin, polyester resin, vinyl ester resin) combined with fillers and curing agents to achieve both adequate bonding strength and low water absorption rate of 0.5% or less

Inventive Principle:

Principle #40Composite materials

2Strength

If the housing is bonded to the base with adhesive, then the housing is securely attached, but moisture can infiltrate into gaps causing semiconductor chip degradation

Engineering Contradiction:

Improveattachment strengthVSAvoidmoisture infiltration

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent changes the water absorption parameter of the adhesive to 0.5% or less, creating a moisture-resistant barrier that prevents moisture infiltration while maintaining attachment strength

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The low water absorption rate adhesive acts as an intermediary barrier between the external moisture environment and the semiconductor chip, preventing moisture infiltration while allowing the housing to remain securely attached to the base

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces the likelihood of adhesive detachment and moisture infiltration into the semiconductor module, thereby protecting the semiconductor chip and ensuring reliable bonding of components, as demonstrated by successful reliability tests under high-temperature and high-humidity conditions.

Implementation Method 1

an adhesive having a water absorption rate of 0.5% or less

Methodology Applied

Scientific EffectWater absorption: Absorption (physical)

Data Source

PatentUS20240250015A1Semiconductor module

Publication Date: 2024.07.25 FUJI ELECTRIC CO LTD

AI summary

A semiconductor module includes a semiconductor unit including a semiconductor chip, a housing for accommodating the semiconductor unit, and a target member bonded to the housing by an adhesive having a water absorption rate of 0.5% or less.