Semiconductor Adhesive Bonding Strength Moisture Resistance
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Solution Overview
Problem
Typical thiol-based curing agents used in semiconductor devices and image sensor modules exhibit poor moisture resistance due to ester structures, leading to a decrease in bonding strength after curing.
Innovation Solution
A semiconductor device and image sensor module are configured with adherends bonded using a cured adhesive containing epoxy resin, a thiol compound represented by a specific general formula, and a latent curing agent, which suppresses the decrease in bonding strength during moisture resistance tests.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a typical thiol-based curing agent (containing ester structure) is used in the adhesive, then low-temperature fast curability is achieved, but moisture resistance of the resin composition deteriorates
Solution Approach 1:
The patent changes the chemical structure parameter of the thiol-based curing agent by replacing the ester structure with a cyclic carbonate structure. This structural parameter change maintains the low-temperature fast curability while eliminating the moisture resistance problem caused by ester hydrolysis. The cyclic carbonate structure provides both rapid reactivity at low temperatures and hydrolytic stability.
Solution Approach 2:
The patent creates a composite adhesive system combining epoxy resin with a specifically designed thiol-based curing agent featuring cyclic carbonate groups. This composite material approach integrates the fast-curing capability of thiol compounds with the moisture resistance of cyclic carbonate structures, achieving both desired properties simultaneously in the cured resin composition.
2Strength
If epoxy resin with thiol-based curing agent is used for bonding, then bonding strength is achieved, but bonding strength decreases after moisture resistance test
Solution Approach 1:
The patent modifies the chemical structure parameter of the curing agent from ester-containing to cyclic carbonate-containing. This parameter change preserves the initial bonding strength achieved through epoxy-thiol crosslinking while preventing the degradation that occurs with moisture exposure, thereby maintaining bonding strength after curing in humid environments.
Solution Approach 2:
The patent converts the potential harm of moisture exposure to ester structures into a benefit by using cyclic carbonate structures that are inherently resistant to hydrolysis. The cyclic carbonate group provides both the desired reactivity for strong bonding and resistance to moisture-induced degradation, turning a previously harmful chemical feature into a beneficial one.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a highly reliable semiconductor device and image sensor module with maintained bonding strength after curing, even under high humidity and temperature conditions, enhancing their durability and performance.
Implementation Method 1
an adhesive containing (A) epoxy resin, (B) a thiol compound, and (C) a latent curing agent
Implementation Method 2
an epoxy-resin-thiol-curing-agent-based resin composition is effective for realizing recently-demanded high low-temperature fast curability
Data Source
AI summary
The present invention is intended to provide a semiconductor device including adherends bonded with a cured product of an adhesive, the semiconductor device being configured such that a decrease in bonding strength after curing in a moisture resistance test is suppressed. In this semiconductor device, at least two adherends 20 and 70, 70 and 60, 70 and 50 made of at least one material selected from the group consisting of engineering plastic, ceramics, and metal are bonded with a cured product 10 of an adhesive containing (A) thermosetting resin, (B) a particular thiol compound, and (C) a latent curing agent.