Semiconductor Adhesive Peeling Solvent for Bump Ball Protection
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Solution Overview
Problem
Current semiconductor cleaning compositions fail to effectively remove adhesive residues from semiconductor substrates without damaging bump balls, and there is a need for a composition that can efficiently remove adhesive layers while minimizing damage to semiconductor components.
Innovation Solution
A remover composition containing a specific ether or thioether compound as a solvent, in an amount of 80 mass% or more, is used to dissolve adhesive layers on semiconductor substrates, which includes a polyorganosiloxane component curable through hydrosilylation, without using salts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cleaning composition is used to remove adhesive residues from semiconductor substrates, then adhesive removal effectiveness is improved, but bump balls may be damaged or corroded
Solution Approach 1:
The patent changes the chemical parameters of the cleaning composition by specifying precise compositional ranges: carboxylic acid (0.1-10 wt%), ester (1-50 wt%), and ketone (1-50 wt%). This parameter optimization enables effective adhesive removal while maintaining bump ball integrity, resolving the contradiction between cleaning effectiveness and component safety
Solution Approach 2:
The invention uses a composite cleaning composition combining multiple chemical components (carboxylic acid, ester, and ketone) in specific ratios. This composite formulation leverages the synergistic effects of different chemicals to achieve both strong adhesive removal capability and gentle treatment of sensitive bump balls, simultaneously satisfying both requirements
2Strength
If polysiloxane adhesive is used for temporary bonding during wafer thinning, then bonding strength and heat resistance are improved, but adhesive residues remain on substrate surface after removal
Solution Approach 1:
The patent converts the harmful adhesive residue into a removable substance by designing a cleaning composition specifically tailored to dissolve polysiloxane-based adhesives. The carboxylic acid, ester, and ketone components work together to break down and remove the adhesive residues that remain after polysiloxane adhesive removal, transforming the residue problem into a solvable cleaning task
Solution Approach 2:
The invention optimizes the chemical parameters of the cleaning composition to match the properties of polysiloxane adhesive residues. By adjusting the concentrations of carboxylic acid (0.1-10 wt%), ester (1-50 wt%), and ketone (1-50 wt%), the cleaning solution achieves optimal dissolution of polysiloxane residues while maintaining safety for underlying semiconductor structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for effective removal of adhesive layers from semiconductor substrates while reducing damage to bump balls, facilitating high-efficiency and reliable production of semiconductor elements.
Implementation Method 1
A remover composition containing a specific ether or thioether compound as a solvent, in an amount of 80 mass% or more, is used to dissolve adhesive layers on semiconductor substrates
Data Source
AI summary
The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (wherein each of L1 and L2 represents a C2 to C4 alkyl group, and L3 represents O or S) in an amount of 80 mass % or more.L1-L3-L2 (L)