Adhesive Composition for Semiconductor Chips with Photocurable Peelability
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Solution Overview
Problem
Existing adhesive materials for temporary fixing of thin semiconductor chips during manufacturing processes face challenges such as foaming and lifting at high temperatures, leading to defects, and insufficient adhesive force during peeling due to thermal decomposition and additive migration.
Innovation Solution
A novel adhesive composition comprising a binder resin with silicon-based and photoreactive functional groups, a photoinitiator, and a multifunctional crosslinking agent, which provides excellent adhesion stability and heat resistance, allowing for easy peeling without residue through photocuring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional adhesive materials are used for temporary fixing, then adhesive force is provided during manufacturing processes, but foaming and lifting occur at high temperatures leading to defects
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by incorporating silicon-based functional groups and photoreactive functional groups in specific ratios (20-95 wt% photoreactive groups based on total weight of second repeat units). This compositional parameter change enables the adhesive to maintain stability at high temperatures while providing controlled adhesion properties.
Solution Approach 2:
The patent creates a composite adhesive system combining multiple functional components: binder resin with silicon-based functional groups, photoreactive functional groups, crosslinking agents, and photoinitiators. This composite structure provides both high-temperature stability and controlled adhesion, resolving the contradiction between heat resistance and adhesion stability.
2Ease of operation
If UV curable adhesive is used to enable easy peeling, then adhesive force can be lowered by UV irradiation, but thermal decomposition of additives occurs during high temperature processes
Solution Approach 1:
The patent extracts and eliminates problematic conventional additives (such as unstable photoinitiators and migration-prone components) from the adhesive formulation. By removing these decomposable additives and replacing them with thermally stable alternatives, the adhesive maintains reliability during high-temperature processes while retaining UV-curable peelability.
Solution Approach 2:
The patent changes the chemical parameters of the photoinitiator and curing system to use compounds with higher thermal stability thresholds. This parameter change allows the adhesive to withstand high-temperature semiconductor manufacturing processes without thermal decomposition, while still enabling easy peeling through UV irradiation.
3Reliability
If adhesive force is maintained during high temperature processes, then thermal decomposition occurs leading to insufficient adhesive force during peeling
Solution Approach 1:
The patent introduces dynamic controllability to the adhesive system through dual-curing capability. The adhesive can be activated or deactivated on demand: maintained during high-temperature processes through thermal stability, and easily reduced during peeling through UV irradiation. This dynamic response resolves the contradiction between maintaining adhesive force and enabling easy peeling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition ensures reliable adhesion during high-temperature semiconductor manufacturing processes and efficient peeling without foaming or lifting, enhancing process efficiency and semiconductor quality.
Implementation Method 1
a photoinitiator; and (c) a multifunctional crosslinking agent, wherein the (meth)acrylate resin having silicon-based functional groups and photoreactive functional groups
Implementation Method 2
binder resin comprising (meth)acrylate resin having silicon-based functional groups and photoreactive functional groups
Implementation Method 3
a multifunctional crosslinking agent, wherein the (meth)acrylate resin having silicon-based functional groups and photoreactive functional groups comprises first repeat units derived from (meth)acrylate monomers having silicon-based functional groups
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3
AI summary
The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.