Semiconductor Device With Non-Uniform Conductive Adhesive Thickness
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Solution Overview
Problem
The existing semiconductor mounting techniques using anisotropic conductive films face challenges in maintaining stable electrical connections due to pressure-induced separation between electrodes and electrode patterns, particularly when the conductive adhesive layer is subjected to high pressure.
Innovation Solution
A semiconductor device design featuring a conductive adhesive layer with pillars of uniform length, where the thickness of the adhesive layer is optimized to ensure stable adhesion and electrical connectivity between the pillars and electrode patterns, even with a wide area, using a formula that accounts for the area and height of the pillars.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If pressure is applied to the conductive adhesive layer to ensure adhesion, then adhesive strength is improved, but electrical connection between electrodes and electrode patterns deteriorates due to pressure-induced separation
Solution Approach 1:
The conductive adhesive layer is designed with non-uniform thickness: a first thickness in regions corresponding to electrode patterns and a second thickness (greater than the first) in regions corresponding to electrodes. This local quality variation ensures that pressure is distributed appropriately - sufficient adhesion is achieved in electrode pattern regions while electrode regions maintain adequate conductive material for reliable electrical connection, thus resolving the contradiction between adhesive strength and electrical connection stability.
Solution Approach 2:
The invention changes the thickness parameter of the conductive adhesive layer spatially, creating a thickness gradient across different functional regions. By controlling the thickness parameter to be non-uniform (first thickness for electrode patterns, second greater thickness for electrodes), the system optimizes both adhesion and electrical connection properties simultaneously, resolving the contradiction between these two requirements.
2Reliability
If the conductive adhesive layer is made thicker to ensure electrical connection, then electrical conductivity is improved, but adhesive precision and stability deteriorate
Solution Approach 1:
Rather than making the entire conductive adhesive layer uniformly thick (which would compromise manufacturing precision), the invention applies local quality by creating different thickness zones: a thinner first thickness region for electrode patterns and a thicker second thickness region for electrodes. This localized approach ensures electrical connection reliability where needed while maintaining overall thickness control and manufacturing precision.
Solution Approach 2:
The conductive adhesive layer is segmented into different thickness regions corresponding to different functional areas (electrode patterns vs. electrodes). This segmentation allows each region to have optimized thickness for its specific function, avoiding the need for a uniformly thick layer that would be difficult to manufacture with precision.
3Ease of manufacture
If a uniform thickness is used for the conductive adhesive layer, then manufacturing simplicity is improved, but electrical connection reliability deteriorates due to pressure-induced separation
Solution Approach 1:
The invention transitions from uniform thickness (easy to manufacture) to local quality variation (different thicknesses in different regions). By creating a first thickness region for electrode patterns and a second greater thickness region for electrodes, the system achieves reliable electrical connection while maintaining reasonable manufacturing feasibility through controlled non-uniformity.
Solution Approach 2:
The thickness parameter of the conductive adhesive layer is changed from a uniform value to a spatially varying distribution. This parameter change enables the system to achieve both adhesion and reliable electrical connection by optimizing thickness for each functional region, accepting increased manufacturing complexity as necessary for improved reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures stable adhesion and electrical connectivity between the electrode and electrode patterns, maintaining effective contact even with a large area conductive adhesive layer, thereby minimizing electrical separation and enhancing the reliability of the semiconductor device.
Implementation Method 1
a conductive adhesive layer including conductive substances configured to electrically-connect the pillars and the electrode patterns to each other
Implementation Method 2
The adhesive layer is formed as an adhesive, which is hardened by heat
Data Source
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Figure 3~4
Figure 5
AI summary
A semiconductor device includes: an electrode including a plurality of pillars having the same length; a semiconductor element configured to receive electric energy from the electrode; a substrate having electrode patterns for transmitting electric energy or a signal to the semiconductor element; and a conductive adhesive layer including conductive substances configured to electrically-connect the pillars and the electrode patterns to each other, and including a body which encloses the conductive substances.