Semiconductor Adhesive Composition for High-Speed Dicing
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Solution Overview
Problem
Existing adhesive compositions for semiconductor bonding face challenges such as low light transmittance, difficulty in detecting alignment marks, delamination, and poor heat resistance, especially when used with high-pin-count bump electrodes and during high-speed dicing processes, leading to contamination and defects.
Innovation Solution
An adhesive composition comprising an organic-solvent-soluble polyimide, an epoxy compound, and a hardening accelerator, with a specific ratio and structure that allows for high light transmittance, precise alignment mark detection, and stable bonding, even at high speeds, while minimizing defects and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive composition contains inorganic filler or micro capsule to improve bonding strength, then bonding reliability is improved, but light transmittance decreases making alignment mark detection impossible
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by using a polyimide resin with specific molecular weight range (10,000-100,000) and controlling the ratio of soluble resin to total resin between 20-80 wt%, achieving both high bonding reliability and light transmittance of 70% or more without requiring inorganic fillers
Solution Approach 2:
The patent creates a composite adhesive system combining polyimide resin with specific physical properties (solubility in organic solvents, molecular weight characteristics) rather than using traditional inorganic filler-based composites, achieving dual functionality of structural integrity and optical transparency
2Measurement precision
If adhesive composition is made thinner to enable bump electrode position detection, then alignment detection is improved, but bonding strength decreases causing bad connection
Solution Approach 1:
The patent changes the rheological and bonding parameters of the adhesive by controlling polyimide molecular weight and solvent content, enabling the adhesive to maintain high bonding strength at reduced thicknesses where bump electrode positions remain detectable
3Productivity
If dicing is carried out at high speed to improve productivity, then production efficiency is improved, but contamination with dicing dust and defects increase
Solution Approach 1:
The patent applies beforehand cushioning by forming a protective adhesive layer on the semiconductor wafer before dicing, which cushions against dicing dust contamination and mechanical defects during high-speed cutting processes
Solution Approach 2:
The patent modifies the adhesive layer parameters (composition, thickness, curing properties) to optimize its protective function during high-speed dicing, enabling contamination-free cutting at increased productivity
4Reliability
If adhesive composition uses conventional materials to achieve bonding, then bonding function is achieved, but heat resistance and delamination resistance are insufficient
Solution Approach 1:
The patent employs a composite material system based on polyimide resin with specific molecular weight and solubility characteristics, providing inherent high heat resistance and delamination resistance while maintaining bonding functionality
Solution Approach 2:
The patent changes the thermal stability parameters of the adhesive by selecting polyimide resin with specific structural characteristics and molecular weight range, achieving superior heat resistance without sacrificing bonding performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition enables precise and reliable bonding of semiconductor chips to circuit substrates with high-pin-count bump electrodes, maintaining alignment mark visibility and reducing defects during dicing, and provides stable electrical conduction and heat resistance.
Implementation Method 1
an adhesive composition for semiconductor comprising an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c)
Implementation Method 2
it has a light transmittance of 70% or more
Implementation Method 3
an epoxy compound (b) and a hardening accelerator (c)
Implementation Method 4
provides stable electrical conduction and heat resistance
Data Source
AI summary
An adhesive composition for semiconductor containing an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.