Semiconductor Adhesive Layer Removal Using Swelling-Dissolution Chemistry

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Solution Overview

Problem

Existing cleaning agent compositions for semiconductor substrates take a long time to remove adhesive residue, necessitating a more efficient and cleaner method for adhesive layer removal.

Innovation Solution

A cleaning method using a composition containing a quaternary ammonium salt, an amide-based solvent, and a specific solvent, which swells and dissolves the adhesive layer on semiconductor substrates, allowing for rapid and thorough removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a cleaning agent composition is used to dissolve adhesive residue on semiconductor substrate, then the adhesive residue can be removed, but it takes a long time to remove the adhesive residue completely

Engineering Contradiction:

Improvecleanliness of substrate surfaceVSAvoidtime required for adhesive residue removal

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent changes the chemical parameters of the cleaning composition by incorporating specific solvents (cyclic carbonate esters like propylene carbonate, chain carbonate esters like ethyl methyl carbonate) and surfactants (alkyl polyglycosides, alkyl polyglucosides) in optimized concentrations. This parameter optimization enables faster dissolution of polysiloxane-based adhesive residues while maintaining complete removal, reducing cleaning time without compromising substrate cleanliness

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces surfactants as intermediary substances that mediate between the cleaning composition and the adhesive residue. These surfactants (alkyl polyglycosides and alkyl polyglucosides) act as intermediaries that enhance the wetting and penetration capabilities of the cleaning solution, facilitating faster and more complete removal of adhesive residues from the semiconductor substrate surface

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If a strong cleaning agent is used to remove adhesive residue quickly, then the removal time is reduced, but the cleaning may not be thorough and residue may remain

Engineering Contradiction:

Improvespeed of adhesive layer removalVSAvoidcompleteness of residue removal

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent employs a composite cleaning composition formulation that combines multiple components with complementary functions: cyclic carbonate esters (propylene carbonate), chain carbonate esters (ethyl methyl carbonate), surfactants (alkyl polyglycosides, alkyl polyglucosides), and water. This composite formulation achieves both rapid adhesive layer removal and complete residue elimination by leveraging the synergistic effects of different materials

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The cleaning process is segmented into multiple functional components, each targeting specific aspects of adhesive removal. The cleaning composition is divided into: solvents for penetration and swelling, surfactants for emulsification and detachment, and chelating agents for residue dissolution. This segmentation allows simultaneous achievement of fast removal and complete cleanliness

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables cleaner and faster removal of adhesive layers from semiconductor substrates, enhancing the efficiency of semiconductor substrate processing.

Implementation Method 1

the adhesive layer can be released from the substrate by swelling the adhesive layer

Methodology Applied

Scientific EffectSwelling:

Implementation Method 2

an adhesive layer which is a cured film obtained from a siloxane-based adhesive containing a polyorganosiloxane component (A′) that is cured by a hydrosilylation reaction using a composition containing a specific component, thereby simultaneously swelling, releasing, and dissolving the adhesive layer

Methodology Applied

Scientific EffectDissolution: Solvation

Data Source

PatentUS20260022312A1Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and releasing and dissolving composition

Publication Date: 2026.01.22 NISSAN CHEM CORP

AI summary

A method for cleaning a semiconductor substrate, that includes releasing and dissolving an adhesive layer on a semiconductor substrate using a releasing and dissolving composition that contains a quaternary ammonium salt, an amide-based solvent, and a solvent represented by formula (G):where L11 and L12 each independently represents an alkyl group having 1 to 6 carbon atoms, and a total number of carbon atoms in the alkyl group of L11 and the alkyl group of L12 is 7 or less.