Semiconductor Adhesive Layer Removal Using Swelling Solvent Composition

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Solution Overview

Problem

Existing cleaning agent compositions for semiconductor substrates take a long time to remove adhesive residue, necessitating a more efficient and cleaner method for adhesive layer removal.

Innovation Solution

A cleaning method using a composition comprising a quaternary ammonium salt, an amide-based solvent, and specific solvents to swell and dissolve adhesive layers on semiconductor substrates, particularly those formed from siloxane-based adhesives, allowing for rapid removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of time

If conventional cleaning agent compositions are used to remove adhesive residue, then the adhesive layer can be dissolved, but it takes a long time to complete the cleaning process

Engineering Contradiction:

Improvecleaning timeVSAvoidprocessing efficiency

Core Design Contradiction:

Loss of timeVSProductivity

Solution Approach 1:

The patent changes the chemical parameters of the cleaning composition by incorporating specific solvents (dichloromethane, chloroform, carbon tetrachloride) that have higher dissolving power for polysiloxane-based adhesives. This parameter change enables rapid swelling and dissolution of the adhesive layer, reducing cleaning time from hours to minutes while maintaining thorough residue removal

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The cleaning composition is formulated as a composite system combining multiple components: the specific solvent (dichloromethane, chloroform, or carbon tetrachloride) as the primary dissolving agent, water as a secondary component, and optional additives. This composite approach synergistically enhances the dissolving capability and speeds up the adhesive removal process

Inventive Principle:

Principle #40Composite materials

2Productivity

If a strong cleaning agent is used to remove adhesive residue quickly, then processing time is reduced, but the cleaning may not be thorough enough

Engineering Contradiction:

Improveprocessing efficiencyVSAvoidcleaning effectiveness

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent optimizes the concentration parameters of the cleaning composition, specifying that the specific solvent should constitute 5-50 mass% of the total composition. This parameter optimization ensures sufficient dissolving power for rapid cleaning while maintaining thoroughness. The controlled water content (45-50 mass%) further enhances the cleaning effectiveness by facilitating complete adhesive layer dissolution

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces water as an intermediary component that works synergistically with the organic solvent. The water component facilitates the swelling and softening of the adhesive layer, making it more susceptible to dissolution by the organic solvent. This intermediary action ensures both rapid and thorough cleaning without requiring excessively strong chemicals

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables swift and thorough removal of adhesive layers from semiconductor substrates, improving processing efficiency and reducing operational time.

Implementation Method 1

the adhesive layer can be swollen and the adhesive layer can be released from the substrate

Methodology Applied

Scientific EffectSwelling:

Implementation Method 2

releasing and dissolving an adhesive layer formed on a semiconductor substrate using a releasing and dissolving composition

Methodology Applied

Scientific EffectDissolution: Solvation

Data Source

PatentUS20260022313A1Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and releasing and dissolving composition

Publication Date: 2026.01.22 NISSAN CHEM CORP

AI summary

Please delete the current Abstract and replace it with the following substitute Abstract: A method for cleaning a semiconductor substrate, that includes releasing and dissolving an adhesive layer formed on a semiconductor substrate using a releasing and dissolving composition that contains: a quaternary ammonium salt; an amide-based solvent; a solvent represented by one of Formulae (L0) to (L4); and a solvent represented by Formula (T) or (G).