Semiconductor Kit Using Solvent A B C to Suppress Adhesive Residue
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Solution Overview
Problem
Existing methods for manufacturing semiconductor devices using temporary adhesives often result in residue contamination on the device substrate, affecting the substrate's characteristics due to inappropriate solvent selection for forming, washing, and peeling steps.
Innovation Solution
A kit comprising specific solvents A, B, and C, where solvent A is used for forming the temporary adhesive layer, solvent B for washing excessive adhesive, and solvent C for peeling, with carefully defined vapor pressures and solubility parameters to minimize residue formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a temporary adhesive is used to fix the device substrate to the carrier substrate, then the device substrate can be temporarily fixed for processing, but residue contamination occurs on the device substrate when peeled off
Solution Approach 1:
The patent changes the chemical parameters of the temporary adhesive by specifying precise compositional ratios (cycloolefin polymer 5-40 parts, diaryl silicone 5-50 parts, dialkyl silicone 5-50 parts, fluorinated alkyl 1-30 parts, fluorinated alkenyl 1-30 parts, and specific additives). This parameter optimization ensures the adhesive provides reliable bonding during processing while enabling clean peeling without residue contamination.
Solution Approach 2:
The patent uses a composite temporary adhesive formulation combining multiple polymer types (cycloolefin polymer as base, diaryl silicone and dialkyl silicone for flexibility, fluorinated compounds for release properties). This composite material achieves both strong adhesion during processing and easy clean peeling, resolving the contradiction between bonding reliability and residue-free release.
2Length of moving object
If the device wafer thickness is reduced for miniaturization, then higher integration is achieved, but the wafer becomes more fragile and difficult to handle
Solution Approach 1:
The patent employs a flexible temporary adhesive layer that can conform to and support the thin device wafer during handling and processing. This adhesive film provides mechanical reinforcement to the thinned wafer, enabling reliable handling despite the reduced wafer thickness required for miniaturization.
Solution Approach 2:
The temporary adhesive acts as an intermediary between the device substrate and carrier substrate, providing mechanical support and protection to the thinned device wafer during processing. This mediator enables handling of fragile thin wafers without direct mechanical contact that could cause damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses residue formation from temporary adhesives, ensuring a clean and reliable semiconductor device manufacturing process by optimizing solvent selection for each step.
Implementation Method 1
a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and solvent A
Implementation Method 2
at least some of an excessive amount of the temporary adhesive on the first substrate is washed using a composition containing solvent B
Implementation Method 3
one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C.
Implementation Method 4
the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using a composition containing solvent C
Data Source
AI summary
Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.