Semiconductor Processing Sheet Adhesive Residue Suppression
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Solution Overview
Problem
Existing semiconductor processing sheets fail to effectively suppress the generation of stain-like residues on semiconductor wafers during back grinding, despite efforts to improve embedding properties for uneven surfaces, as residual pressure-sensitive adhesive components remain and cause faults in the device.
Innovation Solution
A semiconductor processing sheet with a pressure-sensitive adhesive layer composed of acrylic polymers (A) and (B) having different molecular weight distributions, where the gel fraction is between 50-70% and the number average molecular weight of the sol content is 60,000 or more, ensuring favorable embedding properties while minimizing residue formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pressure sensitive adhesive sheet is used to protect the front face of a semiconductor wafer during back grinding, then the front face is protected from damage, but stain-like residues remain on the wafer surface
Solution Approach 1:
The patent changes the molecular weight distribution parameters of the acrylic polymer adhesive, specifically setting Mw/Mn between 2.0-4.0 and Mn between 50,000-200,000, to optimize the balance between embedding properties and residue suppression. This parameter optimization allows the adhesive to adequately fill bumps while reducing low molecular weight components that cause staining.
Solution Approach 2:
The patent uses a composite pressure sensitive adhesive layer combining acrylic polymer with specific molecular weight characteristics, creating a material that integrates both embedding capability and residue suppression properties within a single adhesive system.
2Manufacturing precision
If the pressure sensitive adhesive layer has high embedding properties to fill bumps, then uneven surfaces are protected, but more adhesive remains in the unevenness causing residues
Solution Approach 1:
The patent optimizes the molecular weight distribution parameters (Mw/Mn: 2.0-4.0, Mn: 50,000-200,000) to achieve a balance where the adhesive has sufficient viscosity and adhesion for embedding bumps, while the controlled molecular weight distribution prevents excessive adhesive retention in uneven surfaces that would lead to residues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively prevents the generation of stain-like residues on semiconductor wafers, enhancing the embedding properties of the processing sheet and ensuring reliable semiconductor device performance by carefully controlling the molecular weight distribution and gel fraction of the adhesive layer.
Implementation Method 1
a pressure sensitive adhesive layer provided on one surface of the base material
Data Source
AI summary
The semiconductor processing sheet of the present invention is a semiconductor processing sheet including a base material and a pressure sensitive adhesive layer provided on one surface of the base material, wherein the pressure sensitive adhesive layer contains an acrylic polymer (A) having a molecular weight distribution of 3.0 or less and an acrylic polymer (B) having a molecular weight distribution of more than 3.0; and a gel fraction of the pressure sensitive adhesive layer is 50 to 70%, and a number average molecular weight of a sol content thereof is 60,000 or more.