Semiconductor Package Adhesive Ring for Substrate Warpage
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Solution Overview
Problem
As semiconductor devices with increased integration density face warpage issues due to large substrate sizes, leading to difficulties in maintaining planarity and potential damage from stress-induced delamination and cracking caused by coefficient of thermal expansion mismatches, existing packaging technologies struggle to effectively manage these challenges.
Innovation Solution
A ring is attached to the upper surface of the substrate using a combination of adhesive materials with different properties, where a softer, more elastic material is used at corners and a harder material elsewhere to alleviate stress, and in some embodiments, a sacrificial adhesive material is used that can be removed post-attachment to improve planarity and reduce stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a large substrate is used to accommodate increased integration density, then more components can be integrated, but warpage and stress-induced delamination occur
Solution Approach 1:
The patent applies different adhesive materials with different properties (softer, more elastic material at corners vs. harder material elsewhere) to different locations on the substrate. This local differentiation allows the adhesive system to better accommodate stress distribution across the large substrate, maintaining planarity while supporting high integration density.
2Reliability
If adhesive material is applied to reduce stress, then stress-induced damage is reduced, but the bonding strength may be compromised
Solution Approach 1:
The patent uses a softer, more elastic adhesive material specifically at the corner regions where stress concentration occurs, while using a harder adhesive material in the central regions where bonding strength is prioritized. This spatial differentiation of adhesive properties simultaneously addresses both stress resistance and bonding strength requirements.
Solution Approach 2:
The patent changes the physical parameters of the adhesive material (specifically elasticity and hardness) based on location. By selecting adhesive materials with different durometer values and elastic moduli for different regions, the system optimizes both stress absorption at corners and bonding strength at other areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a ring with strategically applied adhesive materials helps in reducing stress-induced damage, maintaining substrate planarity, and facilitating easier bonding of semiconductor devices, thereby enhancing the reliability and integration of semiconductor packages.
Implementation Method 1
a softer, more elastic material is used at corners... to alleviate stress
Data Source
AI summary
A method of forming a semiconductor device includes applying an adhesive material in a first region of an upper surface of a substrate, where applying the adhesive material includes: applying a first adhesive material at first locations of the first region; and applying a second adhesive material at second locations of the first region, the second adhesive material having a different material composition from the first adhesive material. The method further includes attaching a ring to the upper surface of the substrate using the adhesive material applied on the upper surface of the substrate, where the adhesive material is between the ring and the substrate after the ring is attached.