Semiconductor Device Adhesive Sheet Terminal Fixation
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Solution Overview
Problem
Conventional semiconductor devices face issues with the adhesion between resin sealing portions and metal terminals, leading to potential separation and degradation of wire bonding properties, especially during heat cycles, due to insufficient anchoring and interference from dowels used for fixation.
Innovation Solution
A semiconductor device design that incorporates an insulating circuit substrate, external terminals, a base with a support portion, an adhesive sheet, and a sealing portion, where the adhesive sheet is projected into the support portion's opening and adheres to the substrate, and the external terminals are fixed without dowels, enhancing adhesion through heat pressing and using a resin material with improved thermal properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If fine irregularities are provided on metal terminal surfaces to ensure close adhesion by anchoring effect, then adhesion between sealing portion and metal terminal is improved, but adhesion is still insufficient and separation occurs during heat cycles
Solution Approach 1:
An adhesive sheet is introduced as an intermediary component between the metal terminal and the sealing portion. This adhesive sheet specifically addresses the adhesion problem by providing chemical bonding capability that neither the metal terminal nor the sealing resin can achieve alone, preventing separation during heat cycles while maintaining electrical conductivity.
Solution Approach 2:
The terminal case is constructed as a composite structure combining metal terminal, adhesive sheet, and sealing resin. This composite approach leverages the advantages of each material: metal provides electrical conductivity and mechanical strength, adhesive sheet provides strong bonding, and sealing resin provides protection and insulation.
2Stability of the object's composition
If dowels are provided for external terminal fixation, then terminal fixation is improved, but dowels serve as obstacles that hinder adhesion to resin material
Solution Approach 1:
The dowel component is completely removed from the terminal case structure. Instead of using mechanical fixation with dowels, the invention relies on the adhesive sheet to provide both fixation and adhesion functions, eliminating the obstacle that dowels create for resin material bonding.
Solution Approach 2:
The adhesive sheet performs multiple functions simultaneously: it provides mechanical fixation of the terminal, ensures strong adhesion between terminal and sealing portion, maintains electrical conductivity, and prevents separation during heat cycles. This multi-functional approach replaces the separate dowel and adhesive components.
3Ease of manufacture
If conventional resin material is used for sealing portion, then manufacturing simplicity is maintained, but adhesion to metal terminal is insufficient
Solution Approach 1:
The sealing structure is segmented into three distinct components: metal terminal, adhesive sheet, and sealing resin. This segmentation allows each component to be optimized for its specific function while maintaining manufacturing simplicity through a standardized assembly process involving placement and heat pressing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively fixes metal terminals in the terminal case without complex manufacturing processes, improving adhesion and preventing separation, thus enhancing the reliability and electrical characteristics of the semiconductor device by ensuring close contact and chemical bonding between the adhesive sheet and external terminals.
Implementation Method 1
conventional resin material for injection molding (e.g. polyphenylene sulfide (PPS) resin) cannot be used for adhesion to a metal terminal directly by chemical bonding
Implementation Method 2
enhancing adhesion through heat pressing
Data Source
AI summary
The semiconductor device includes an insulating circuit substrate mounted with a semiconductor element; an external terminal; a base including a support portion; an adhesive sheet; and a sealing portion covering the semiconductor element. The support portion has a first surface, a second surface on the side opposite to the first surface, and a first opening opened at the first surface and the second surface. The insulating circuit substrate is disposed in the first opening. The adhesive sheet is disposed on the second surface of the support portion and has a second opening in which the semiconductor element is disposed in plan view. The adhesive sheet is projected into the first opening in plan view and adhered to a circuit block. The external terminal is adhered on the adhesive sheet and has a connecting surface to which a bonding wire is connected.