Semiconductor Adhesive with Silicon Carbide and Silver Fillers
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Solution Overview
Problem
Adhesives used in semiconductor devices face issues with thermal stress and heat dissipation due to mismatched thermal expansion coefficients between semiconductor dies and die pads, leading to delamination or cracking, and poor thermal conductivity with fillers like silica or Teflon results in deteriorated electrical performance.
Innovation Solution
An adhesive composition comprising a binder resin and silicon carbide filler, which has high thermal conductivity and low thermal expansion coefficient, combined with an electrically conductive filler like silver to enhance heat dissipation and prevent delamination, while maintaining electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silver (Ag) is used as a filler to achieve excellent electrical conductivity, then electrical conductivity is improved, but thermal stress increases due to large thermal expansion coefficient causing delamination or cracking
Solution Approach 1:
The patent employs a composite filler system combining silver particles (for electrical conductivity) with silica particles (for thermal expansion matching). This composite approach allows the adhesive to simultaneously achieve excellent electrical conductivity while reducing thermal stress through the silica component's low thermal expansion coefficient, preventing delamination and cracking.
Solution Approach 2:
The patent modifies the filler composition parameters by introducing silica particles with specific thermal expansion coefficients that match the semiconductor die and die pad materials. This parameter adjustment balances the thermal expansion characteristics of the adhesive, reducing thermal stress while maintaining the electrical conductivity provided by silver fillers.
2Strength
If silica or Teflon is used as a filler to reduce thermal expansion mismatch, then thermal stress is reduced, but thermal conductivity decreases significantly leading to poor heat dissipation
Solution Approach 1:
The patent creates a composite filler system where silica particles (providing thermal expansion matching) are combined with silver particles (providing thermal and electrical conductivity). This composite structure allows the adhesive to simultaneously achieve low thermal expansion mismatch for stress reduction while maintaining high thermal conductivity through the silver component, enabling effective heat dissipation.
Solution Approach 2:
The patent optimizes the composition parameters by incorporating silver fillers alongside silica fillers. This parameter modification enhances the thermal conductivity of the adhesive system while maintaining the low thermal expansion characteristics, thus improving heat dissipation performance without sacrificing adhesion strength.
3Temperature
If high filler content is used to improve thermal conductivity, then thermal conductivity is improved, but viscosity increases making application difficult
Solution Approach 1:
The patent controls the particle size parameters of the filler materials to optimize the balance between thermal conductivity and viscosity. By using appropriately sized filler particles, the adhesive maintains good flow properties and applicability even with high filler content, ensuring both thermal performance and ease of application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition improves heat dissipation and electrical performance by reducing thermal stress and preventing delamination, with optimal filler content balancing thermal and electrical conductivity.
Implementation Method 1
The silicon carbide filler has relatively high thermal conductivity... the adhesive composition containing the silicon carbide filler exhibits improved heat dissipation performance due to high thermal conductivity
Implementation Method 2
the silicon carbide filler has relatively high thermal conductivity and a relatively low coefficient of thermal expansion (CTE)... shows inhibition of delamination or cracking of semiconductor devices due to low CTE
Implementation Method 3
When silver (Ag) is used as a filler, an adhesive with excellent electrical conductivity is obtained... an electrically conductive adhesive can be obtained by additional incorporation of a silver (Ag) filler into the binder resin
Data Source
AI summary
Provided is an adhesive composition for a semiconductor device. For example, the adhesive composition comprises a binder resin and a silicon carbide filler. The silicon carbide filler has relatively high thermal conductivity and a relatively low coefficient of thermal expansion (CTE). Accordingly, the adhesive composition containing the silicon carbide filler exhibits improved heat dissipation performance and electrical performance due to high thermal conductivity and shows inhibition of delamination or cracking of semiconductor devices due to low CTE. The silicon carbide has high thermal conductivity, but is electrically non-conductive. Therefore, an electrically conductive adhesive can be obtained by additional incorporation of a silver (Ag) filler into the binder resin.