Semiconductor Device Adhesive Coverage for Small Memories
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Solution Overview
Problem
In semiconductor devices with a Film On Die (FOD) structure, the Die Attach Film (DAF) becomes insufficient when memories are relatively small compared to the controller, leading to potential instability and reliability issues due to insufficient adhesive coverage.
Innovation Solution
A semiconductor device design that includes a plate member with an organic layer and an inorganic layer, where the controller is embedded in a Die Attach Film (DAF) made of acrylic polymer and epoxy resin, and the memories are attached to the plate member with a spacer and additional adhesive layers, ensuring sufficient adhesive coverage and stability using a sealing resin that adheres better to organic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the memories are made relatively small to reduce device size, then the device compactness is improved, but the adhesive coverage of the DAF becomes insufficient leading to reliability issues
Solution Approach 1:
The patent uses a composite adhesive layer combining acrylic polymer and epoxy resin, where the acrylic polymer provides flexibility and the epoxy resin provides strong adhesion. This composite material ensures sufficient adhesive coverage and reliable bonding even when the DAF size is reduced to accommodate smaller memories, thereby maintaining reliability while achieving device compactness.
2Quantity of substance
If the DAF size is reduced to match smaller memories, then material usage is reduced, but the embedded state of the controller becomes insufficient
Solution Approach 1:
The patent modifies the chemical composition parameters of the adhesive layer by combining acrylic polymer and epoxy resin in specific proportions. This parameter change enables the adhesive layer to maintain sufficient volume and embedding capability for the controller even when the overall DAF size is reduced, thus preserving the embedded state stability while reducing material quantity.
3Reliability
If additional adhesive layers and spacers are added to ensure coverage, then adhesion reliability is improved, but the device complexity increases
Solution Approach 1:
The patent combines multiple functional elements into an integrated adhesive layer structure that simultaneously provides adhesion, spacing, and controller embedding functions. By merging these functions into a single composite adhesive layer rather than using separate components, the patent achieves high adhesion reliability while minimizing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design provides reliable adhesion and stability for both the controller and memories, enhancing the yield and preventing peeling issues, even when the memories are smaller than the plate member, by utilizing organic materials that improve adhesion and tensile strength.
Implementation Method 1
The first adhesive layer is positioned between the first surface and the second surface and adheres to the first surface and the second surface
Implementation Method 2
The resin in which the first member, the first adhesive layer, and the second electronic component embedded adheres to the first surface and the third surface
Data Source
AI summary
According to one embodiment, a semiconductor device includes a board, a first member, a first adhesive layer, a first electronic component, a second electronic component, and a resin. The board includes a first surface. The first member includes a second surface, and a third surface made of a material including a first organic material. The first adhesive layer adheres to the first surface and the second surface. The first electronic component is attached to the first surface, and embedded in the first adhesive layer. The resin in which the first member, the first adhesive layer, and the second electronic component embedded adheres to the first surface and the third surface.