Semiconductor Substrate Adhesive Removal via Solvent Dissolution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for manufacturing semiconductor devices with supporting bodies are complex, costly, and prone to mechanical defects due to the formation of solvent supply paths, which also lead to issues like outgassing and metal contamination, and the removal of protection tapes can cause mechanical damage to the thinned semiconductor devices.
Innovation Solution
A method that eliminates the need for solvent supply paths in the supporting body by attaching a supporting body with an adhesive layer to the semiconductor substrate, exposing the adhesive layer, and removing the supporting body by dissolving it with a solvent, thereby simplifying the process and reducing mechanical stress on the semiconductor device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solvent supply paths (penetrating holes or grooves) are formed in the supporting body, then the adhesive layer can be dissolved to remove the supporting body, but the manufacturing process becomes complex and costly, and the supporting body strength decreases
Solution Approach 1:
The invention extracts the solvent supply path from the supporting body and relocates it to the semiconductor substrate. By forming the solvent supply path in the substrate rather than in the supporting body, the supporting body structure is simplified while maintaining the functionality of adhesive layer dissolution.
Solution Approach 2:
The invention introduces an intermediary structure (the solvent supply path in the substrate) that mediates between the supporting body and the adhesive layer. This intermediary allows solvent to reach the adhesive layer without requiring complex structures in the supporting body itself.
2Reliability
If solvent supply paths are formed in the supporting body, then the adhesive layer can be accessed, but metal contamination and outgassing occur, and the supporting body may suffer mechanical damage
Solution Approach 1:
The invention extracts the solvent supply path from the supporting body and places it in the substrate, eliminating the source of metal contamination and outgassing that would occur if paths were formed in the supporting body.
Solution Approach 2:
The supporting body is designed as a disposable component without embedded paths. After serving its purpose of supporting the substrate during manufacturing, it can be easily removed by dissolving the adhesive layer with solvent applied through paths in the substrate, avoiding the need for complex reusable supporting bodies.
3Ease of manufacture
If the supporting body is removed after dicing by peeling, then the protection tape can be eliminated, but mechanical defects occur in the thinned semiconductor device
Solution Approach 1:
The invention replaces the mechanical peeling removal method with a chemical dissolution method. Instead of mechanically peeling off the supporting body after dicing, solvent is used to chemically dissolve the adhesive layer, allowing gentle separation that avoids mechanical damage to the thinned semiconductor device.
Solution Approach 2:
The invention changes the removal mechanism from mechanical (peeling) to chemical (dissolution). By changing the parameter of removal method, the process becomes gentler on the fragile thinned device while maintaining simplicity.
4Ease of operation
If penetrating holes are formed in the glass substrate, then the solvent can reach the adhesive layer, but the strength of the supporting body lowers and it may suffer mechanical damage
Solution Approach 1:
The invention extracts the solvent delivery paths from the supporting body and places them in the substrate. This eliminates the need for penetrating holes in the glass substrate, preserving the supporting body's full strength while still enabling solvent delivery to the adhesive layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, enhances the reliability and yield of semiconductor devices by eliminating mechanical defects and the need for complex solvent supply paths, and allows for the thinning and miniaturization of semiconductor devices without compromising their integrity.
Implementation Method 1
separating the supporting body from the semiconductor substrate by supplying a solvent dissolving the adhesive layer from a portion exposing the adhesive layer
Data Source
AI summary
The invention is directed to enhancement of reliability and a yield of a semiconductor device by a method of manufacturing the semiconductor device with a supporting body without making the process complex. A second insulation film, a semiconductor substrate, a first insulation film, and a passivation film are etched and removed in this order using a resist layer or a protection layer as a mask. By this etching, an adhesive layer is partially exposed in an opening. At this time, a number of semiconductor devices are separated in individual semiconductor dies. Then, as shown in FIG. 10, a solvent (e.g. alcohol or acetone) is supplied to the exposed adhesive layer through the opening to gradually reduce its adhesion and thereby a supporting body is removed from the semiconductor substrate.