Semiconductor Adhesive Layer Removal Using Swell-Dissolve Composition

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Solution Overview

Problem

Existing cleaning agent compositions for semiconductor substrates take a long time to remove adhesive residue, and there is a need for a more effective and efficient method to clean semiconductor substrates with adhesive layers in a shorter time.

Innovation Solution

A releasing and dissolving composition containing a quaternary ammonium salt and amide-based solvent, along with specific solvents of low molecular weight, is used to swell and dissolve adhesive layers on semiconductor substrates, allowing for rapid removal of adhesive residue.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a cleaning agent composition is used to remove adhesive residue by dissolution, then the adhesive residue can be removed from the substrate surface, but it takes a long time to remove the adhesive residue

Engineering Contradiction:

Improveadhesive residue removal effectivenessVSAvoidcleaning time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent changes the chemical parameters of the cleaning composition by combining specific solvents (ether compound, thioether compound, aromatic hydrocarbon compound) with quaternary ammonium salts and amide-based solvents. This parameter change enables the composition to simultaneously swell and dissolve the adhesive layer, reducing cleaning time while maintaining removal effectiveness

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite cleaning composition that combines multiple functional components: solvents for swelling (ether, thioether, aromatic hydrocarbon compounds) and dissolution (quaternary ammonium salts with amide-based solvents). This composite approach allows the composition to perform both swelling and dissolution functions simultaneously, achieving faster adhesive residue removal

Inventive Principle:

Principle #40Composite materials

2Reliability

If a polysiloxane-based adhesive is used for temporary adhesion during polishing, then the adhesive can withstand polishing stress and allow easy removal, but adhesive residue remains on the substrate surface after release

Engineering Contradiction:

Improvetemporary adhesion performanceVSAvoidadhesive residue

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful adhesive residue into a beneficial cleaning opportunity by designing a composition that actively swells and dissolves the polysiloxane-based adhesive residue. The quaternary ammonium salts combined with specific solvents transform the residue removal process from a problematic aftermath into an efficient, integrated cleaning function

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent changes the chemical state of the adhesive residue by using a composition that induces swelling followed by dissolution. This parameter change transforms the residual adhesive from a stubborn contaminant into a soluble substance that can be easily removed, addressing the harmful effect while preserving the original adhesive's beneficial temporary adhesion properties

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition enables the clean and efficient removal of adhesive layers from semiconductor substrates in a shorter time, improving the production process by simplifying the operation.

Implementation Method 1

an adhesive layer can be released from a substrate by swelling the adhesive layer

Methodology Applied

Scientific EffectSwelling:

Implementation Method 2

a component [I]: a dissolution component containing a quaternary ammonium salt and an amide-based solvent

Methodology Applied

Scientific EffectDissolution: Solvation

Data Source

PatentEP4672303A1Method for manufacturing semiconductor substrate, method for manufacturing processed semiconductor substrate, and composition for peeling and dissolving

Publication Date: 2025.12.31 NISSAN CHEM CORP

AI summary

Provided is a method for producing a semiconductor substrate including a cleaning step of a semiconductor substrate, capable of removing (cleaning) an adhesive layer from a semiconductor substrate having the adhesive layer on a surface thereof more cleanly in a shorter time by a simple operation, a method for producing a processed semiconductor substrate including such a semiconductor production method, and a composition used in such a cleaning step. A method for producing a semiconductor substrate, including a step of releasing and dissolving an adhesive layer on a semiconductor substrate using a releasing and dissolving composition, and cleaning the adhesive layer, in which the releasing and dissolving composition contains: a component [I]: a dissolution component containing a quaternary ammonium salt and an amide-based solvent, and a component [II]: a release component having a molecular weight of less than 160 and being composed of one or more solvents selected from an ether compound, a thioether compound, an aromatic hydrocarbon compound, an aliphatic hydrocarbon compound, an ester compound, and an amine compound, and a contact angle of the releasing and dissolving composition when the releasing and dissolving composition is added dropwise onto the adhesive layer disposed on the semiconductor substrate is more than 22.6 degrees and less than 46.1 degrees.