Adhesive Tape for Semiconductor Heat Detection
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Solution Overview
Problem
Conventional methods for inspecting semiconductor devices face reduced detection accuracy of heat radiation due to the material composition of the device's surface, particularly when the surface is covered with metal, leading to decreased heat ray emission.
Innovation Solution
A method involving the attachment of an adhesive tape with high emissivity (0.9 or more) and light transmittance (60% or more at 300 nm to 2000 nm) to the semiconductor device's surface to enhance heat radiation detection accuracy, allowing for the identification of heat generation sources by superimposing pattern and heat generation images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the surface of the semiconductor device is covered with metal, then the device structure is formed, but the amount of radiated heat rays decreases
Solution Approach 1:
An adhesive tape with high emissivity (0.9 or more) and high light transmittance (60% or more at 300 nm to 2000 nm) is attached to the metal surface of the semiconductor device. The adhesive tape acts as an intermediary layer that enhances heat radiation detection while allowing optical observation through its high transmittance property.
Solution Approach 2:
The emissivity parameter of the device surface is changed from the original metal surface (low emissivity) to the adhesive tape surface (high emissivity of 0.9 or more). This parameter change significantly improves the detection accuracy of heat rays without altering the underlying device structure.
2Measurement precision
If an adhesive tape with high emissivity is attached to the surface, then heat ray detection accuracy is improved, but the complexity of the inspection process increases
Solution Approach 1:
The adhesive tape serves multiple functions simultaneously: it provides high emissivity for improved heat radiation detection, maintains high light transmittance for optical observation, and can be easily attached and removed. This multi-functionality reduces the need for multiple separate components or complex procedures.
Solution Approach 2:
The adhesive tape is a simple, inexpensive, disposable component that can be attached for the inspection process and then removed or discarded. This avoids the need for permanent modifications to the device or complex reusable setups, thereby reducing overall process complexity.
3Measurement precision
If the adhesive tape is attached to the surface, then emissivity is made uniform, but the ease of electrical signal application is reduced
Solution Approach 1:
The adhesive tape is selectively attached only to the inspection surface of the semiconductor device where uniform emissivity is needed for heat radiation detection. Other areas of the device, particularly those requiring electrical signal application, are left uncovered or have electrodes exposed, maintaining ease of electrical connection while achieving the desired emissivity uniformity on the inspection surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves heat ray detection accuracy and precisely identifies heat generation locations within semiconductor devices, even when the surface is covered with metal, by ensuring uniform emissivity and facilitating easy electrical signal application.
Implementation Method 1
an adhesive tape having an emissivity of 0.9 or more and a light transmittance of 60% or more at a wavelength of 300 nm to 2000 nm
Implementation Method 2
a light transmittance of 60% or more at a wavelength of 300 nm to 2000 nm
Implementation Method 3
the semiconductor device is photographed using an infrared sensor while an electrical signal is applied to the semiconductor device, and a temperature distribution of the semiconductor device is detected from the photographed image
Data Source
Figure 1
Figure 2
Figure 3~3(b)
AI summary
Provided is a method for inspecting a semiconductor device which performs an inspection of a semiconductor device as an object to be inspected, including a first step of attaching an adhesive tape having an emissivity of 0.9 or more and a light transmittance of 60% or more at a wavelength of 300 nm to 2000 nm to a surface to be inspected of the semiconductor device, a second step of detecting light from a region including a surface of the surface to be inspected to which the adhesive tape is attached and acquiring a first pattern image, a third step of inputting an electrical signal to the semiconductor device to which the adhesive tape is attached, a fourth step of acquiring a first heat generation image by detecting light according to heat radiation from the region including the surface to which the adhesive tape is attached in a state in which the electrical signal is input, and a fifth step of superimposing the first pattern image and the first heat generation image.