Semiconductor Chip Adhesive Voids
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Solution Overview
Problem
Voids between the adhesive member and the semiconductor chip in semiconductor packages can lead to chip misalignment, incorrect wire bonding, and reduced reliability due to air expansion during subsequent hot processes.
Innovation Solution
Incorporating void removing parts in the insulation layer that extend from the chip's circuit area to its peripheral area, with various shapes such as grooves, openings, or lattice patterns to prevent void formation by allowing air discharge, and ensuring these parts correspond to fuse boxes and bonding pads for effective void removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive members are used to fix semiconductor chips to substrates, then chip attachment is achieved, but voids are trapped between the adhesive member and semiconductor chip
Solution Approach 1:
The patent applies preliminary action by forming protrusions on the adhesive member before chip attachment. These protrusions are pre-configured to extend into the chip's peripheral area, creating a mechanical interlock structure that prevents void formation during the subsequent bonding process. This preliminary structural preparation ensures that when the chip is attached, the adhesive naturally fills the spaces around the protrusions without trapping air voids.
Solution Approach 2:
The patent utilizes a porous-like structure through the protrusions on the adhesive member. These protrusions create a textured surface that allows the adhesive to penetrate and bond with the chip's peripheral area, similar to how porous materials allow fluid penetration. This structure ensures complete adhesive coverage and eliminates voids by allowing the adhesive to flow into all necessary spaces before curing.
2Strength
If voids are trapped between adhesive member and semiconductor chip, then chip attachment is maintained, but chip inclination occurs
Solution Approach 1:
The protrusions are pre-formed on the adhesive member to extend into the chip's peripheral area before bonding occurs. This preliminary structural configuration ensures that when the chip is attached, the adhesive distributes evenly around the protrusions, preventing void formation that would cause inclination. The protrusions act as mechanical guides that maintain proper chip alignment during the bonding process.
3Device complexity
If voids are trapped between adhesive member and semiconductor chip, then attachment structure is simplified, but wire bonding accuracy deteriorates
Solution Approach 1:
The protrusions are pre-configured on the adhesive member to extend into the chip's peripheral area, creating a structured adhesive pattern that guides proper chip placement. This preliminary structural preparation ensures that the chip aligns correctly with the substrate, which in turn ensures that wire bonding can be performed with high accuracy. The protrusions serve as mechanical references that maintain precise positioning throughout the manufacturing process.
4Ease of manufacture
If voids are trapped between adhesive member and semiconductor chip, then packaging process is simplified, but package reliability deteriorates due to air expansion
Solution Approach 1:
The protrusions are pre-formed on the adhesive member to create a void-preventing structure before packaging. This preliminary structural preparation ensures that no voids are trapped during attachment, eliminating the source of air that would expand during subsequent hot processes. The design maintains manufacturing simplicity while ensuring reliability by preventing void formation at the source rather than requiring complex void removal processes later.
Data Source
AI summary
A semiconductor device having no voids and a semiconductor package using the same is described. The semiconductor device includes a semiconductor chip having a circuit section which is formed in a first area and a peripheral section which is formed in a second area defined around the first area, and an insulation layer covering the first and second areas and having at least one void removing part which extends from the first area to the second area to prevent a void from being formed.