Semiconductor Temporary Adhesive Composition for Wafer Thinning

The patent uses a composite adhesive layer combining a resin component and a rubber component in specific ratios (resin 5-80 parts by mass, rubber 95-20 parts by mass). This composite structure provides both the flexibility needed for back surface protection during grinding and the enhanced heat resistance required for subsequent electrode formation and wiring steps, resolving the contradiction between flexibility and heat resistance.

The patent employs a specific compositional ratio parameter change, controlling the resin to rubber content ratio (5-80 : 95-20 parts by mass) in the adhesive layer. This precise parameter control allows the adhesive to exhibit strong bonding durability during processing while maintaining easy release properties after curing, enabling both reliable bonding and subsequent easy separation of the thinned wafer from the support.

The patent replaces the mechanical/optical decomposition method (high intensity light or laser) with a thermal-mechanical release method. The adhesive layer is designed to be peelable through heating and melting, substituting the need for expensive laser equipment and long processing times with a simpler thermal process that achieves the same peeling function more efficiently.

The patent creates a composite adhesive system combining resin and rubber components with specific molecular weight ranges and ratios. This composite formulation maintains the simplicity of a single-step application process while achieving thermal stability above 200°C through the synergistic combination of components, unlike simple hot-melt hydrocarbon compounds that decompose at high temperatures.